Model RFP-150N50TE

Typical Performance

2

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Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369

Power Derating

Suggested Mounting Procedures

1. Make sure that the devices are mounted on flat surfaces

(.001" under the device) to optimize the heat transfer.

2. Drill & tap the heatsink for the appropriate thread size to be

used.

3. Coat heatsink with a minimum amount of high quality

silicone grease (.001" max. thickness).

4. Position device on mounting surface & secure using socket

head screws, flat & split washers. Torque screws to the

appropriate value. Make sure that the device is flat against

the heatsink. (Care should be taken to avoid upward

pressure of the leads towards the lid).

5. Solder leads in place using an SN63 type solder with a

controlled temperature iron (700°F).

SCALE:

BOARD EVEN

WITH LEAD.

THAN LEAD.

BOARD LOWER

SUGGESTED STRESS RELIEF METHODS

(2 PLACES)

.025

MIN.

NOT RECOMMENDED APPLICATION

BOARD LOWER

THAN LEAD.

THAN LEAD.

BOARD HIGHER

SCALE: