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TLC374CDRG4 Datasheet(PDF) 3 Page - Texas Instruments |
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TLC374CDRG4 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 28 page TLC374, TLC374Q, TLC374Y LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC374Y chip information This chip, when properly assembled, displays characteristics similar to the TLC374C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJMAX = 150°C TOLERANCES ARE ±10% ALL DIMENSIONS ARE IN MILS. PIN (12) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 3OUT 3IN + 3IN – GND (10) (9) (8) (11) (14) – + (13) 4IN + 4IN – 4OUT (12) + – VDD (3) (4) (7) (6) (5) (1) – + (2) 65 90 1IN + 1IN – 2OUT 1OUT 2IN + 2IN – (13) (14) (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (11) (12) |
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