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G952T25UF Datasheet(PDF) 2 Page - Global Mixed-mode Technology Inc

Part # G952T25UF
Description  1.8V 1A Regulator
Download  11 Pages
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Manufacturer  GMT [Global Mixed-mode Technology Inc]
Direct Link  http://www.gmt.com.tw
Logo GMT - Global Mixed-mode Technology Inc

G952T25UF Datasheet(HTML) 2 Page - Global Mixed-mode Technology Inc

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Ver: 2.6
Mar 19, 2007
TEL: 886-3-5788833
http://www.gmt.com.tw
2
G952
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
(Note 1)
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Power Dissipation Internally Limited
(Note 2)
Maximum Junction Temperature . . . . . . . . . . . 150°C
Storage Temperature
Range . . . . . . . . . . . . . . . . . . . . .65°C
≤ TJ ≤+150°C
Reflow Temperature (soldering, 10sec) . . . . . 260°C
Thermal Resistance Junction to Ambient, (θJA)
SOT-89 . . . . . . . . . . . . . . . . . . . . . . . . . . . .173°C/W
SOT-223 . . . . . . . . . . . . . . . . . . . . . . . . . . .148°C/W
TO-252 . . . . . . . . . . . . . . . . . . . . . . . . . . . .124°C/W
Thermal Resistance Junction to Case, (θJc)
SOT-89. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25°C/W
SOT-223. . . . . . . . . . . . . . . . . . . . . . . . . . . 22°C/W
TO-252. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7°C/W
Note (1): See Recommended Minimum Footprint
Operating Conditions
(Note 1)
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . .2.7V~6.5V
Temperature Range. . . . . . . . . . . . . . -40°C
≤ TA ≤85°C
Electrical Characteristics
VIN =3.3V, IO = 1A, CIN = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3]
PARAMETER
CONDITION
MIN
TYP
MAX
UNIT
10mA < IO < 1A
1.764
1.800
1.845
V
Output Voltage
10mA < IO < 550mA (SOT-89)
1.764
1.800
1.845
V
Line Regulation
3V < VIN < 6.5V, IO = 10mA
---
3
30
mV
10mA < IO < 1A
---
30
50
mV
Load Regulation
10mA < IO < 550mA (SOT-89)
---
30
50
mV
Output Impedance
200mA DC and 100mA AC, fo = 120Hz
---
80
---
m
Ω
Quiescent Current
VIN = 3.3V
300
480
1500
µA
Ripple Rejection
fi = 120Hz,Vripple =1VP-P, Io = 100mA
---
53
---
dB
IO = 0A
---
880
---
IO = 100mA
---
895
---
IO = 500mA for (SOT-89,SOT-223,TO-252)
---
950
---
Dropout Voltage
IO = 1A only for (SOT-223,TO-252)
---
1160
---
mV
VIN = 3V(SOT-223)
Minimum footprint
(0.0625 square inch)
---
660
---
mA
VIN = 3.3V(SOT-223)
Mounted on 0.53
square inch pcb area
---
1
---
A
Output Current
Continuous Test,
TA = 25°C, TJ 150°C,
VOUT within ±2%
VIN = 3.3V(SOT-89)
Mounted on 0.16
square inch pcb area
---
0.5
---
A
Short Circuit Current
---
1.6
---
A
Over Temperature
---
150
---
°C
Note 1:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications
and test conditions see the Electrical Characteristics.
Note2:
The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA,
and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If
this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the
G952 in SOT-89 package.
θJA is 173°C/W For the G952 in SOT-223 package, θJA is 148°C/W, in TO-252 package, θJA
is 124°C/W. (See recommend minimum footprint). The safe operation in SOT- 89, SOT-223, TO-252 package, it can
see “Typical Performance Characteristics” (Safe Operating Area).
Note3:
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4:
The type of output capacitor should be tantalum or aluminum.


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