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G952T25UF Datasheet(PDF) 2 Page - Global Mixed-mode Technology Inc |
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G952T25UF Datasheet(HTML) 2 Page - Global Mixed-mode Technology Inc |
2 / 11 page Ver: 2.6 Mar 19, 2007 TEL: 886-3-5788833 http://www.gmt.com.tw 2 G952 Global Mixed-mode Technology Inc. Absolute Maximum Ratings (Note 1) Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature . . . . . . . . . . . 150°C Storage Temperature Range . . . . . . . . . . . . . . . . . . . . .65°C ≤ TJ ≤+150°C Reflow Temperature (soldering, 10sec) . . . . . 260°C Thermal Resistance Junction to Ambient, (θJA) SOT-89 . . . . . . . . . . . . . . . . . . . . . . . . . . . .173°C/W SOT-223 . . . . . . . . . . . . . . . . . . . . . . . . . . .148°C/W TO-252 . . . . . . . . . . . . . . . . . . . . . . . . . . . .124°C/W Thermal Resistance Junction to Case, (θJc) SOT-89. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25°C/W SOT-223. . . . . . . . . . . . . . . . . . . . . . . . . . . 22°C/W TO-252. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7°C/W Note (1): See Recommended Minimum Footprint Operating Conditions (Note 1) Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . .2.7V~6.5V Temperature Range. . . . . . . . . . . . . . -40°C ≤ TA ≤85°C Electrical Characteristics VIN =3.3V, IO = 1A, CIN = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3] PARAMETER CONDITION MIN TYP MAX UNIT 10mA < IO < 1A 1.764 1.800 1.845 V Output Voltage 10mA < IO < 550mA (SOT-89) 1.764 1.800 1.845 V Line Regulation 3V < VIN < 6.5V, IO = 10mA --- 3 30 mV 10mA < IO < 1A --- 30 50 mV Load Regulation 10mA < IO < 550mA (SOT-89) --- 30 50 mV Output Impedance 200mA DC and 100mA AC, fo = 120Hz --- 80 --- m Ω Quiescent Current VIN = 3.3V 300 480 1500 µA Ripple Rejection fi = 120Hz,Vripple =1VP-P, Io = 100mA --- 53 --- dB IO = 0A --- 880 --- IO = 100mA --- 895 --- IO = 500mA for (SOT-89,SOT-223,TO-252) --- 950 --- Dropout Voltage IO = 1A only for (SOT-223,TO-252) --- 1160 --- mV VIN = 3V(SOT-223) Minimum footprint (0.0625 square inch) --- 660 --- mA VIN = 3.3V(SOT-223) Mounted on 0.53 square inch pcb area --- 1 --- A Output Current Continuous Test, TA = 25°C, TJ 150°C, VOUT within ±2% VIN = 3.3V(SOT-89) Mounted on 0.16 square inch pcb area --- 0.5 --- A Short Circuit Current --- 1.6 --- A Over Temperature --- 150 --- °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the G952 in SOT-89 package. θJA is 173°C/W For the G952 in SOT-223 package, θJA is 148°C/W, in TO-252 package, θJA is 124°C/W. (See recommend minimum footprint). The safe operation in SOT- 89, SOT-223, TO-252 package, it can see “Typical Performance Characteristics” (Safe Operating Area). Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum or aluminum. |
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