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HSMU-A400-U85M1 Datasheet(PDF) 6 Page - AVAGO TECHNOLOGIES LIMITED |
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HSMU-A400-U85M1 Datasheet(HTML) 6 Page - AVAGO TECHNOLOGIES LIMITED |
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6 / 9 page  6 Figure 9a. Recommended SnPb Reflow Soldering Profile. Figure 10. Recommended Wave Soldering Profile. Figure 8a. Recommended Soldering Pad Pattern. 240°C MAX. 20 SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. TIME 183°C 100-150°C –6°C/SEC. MAX. 60-150 SEC. 3°C/SEC. MAX. Figure 8b. Recommended Soldering Pad Pattern (TTW). Thermal Resistance Solder Pad Area (xy) 300 °C/W >16 mm2 350 °C/W >12 mm2 470 °C/W >8 mm2 Figure 9b. Recommended Pb-free Reflow Soldering Profile. Note: For detailed information on reflow soldering of Avago surface mount LEDs, refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. 217 °C MAX. 120 SEC. 6 °C/SEC. MAX. 3 °C/SEC. MAX. 125 °C ± 25 °C 255 °C 60 to 150 SEC. 10 to 20 SEC. TIME * THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX. +5 °C -0 °C LAMINAR WAVE BOTTOM SIDE OF PC BOARD HOT AIR KNIFE TURBULENT WAVE FLUXING PREHEAT 010 20 30 50 100 150 200 250 30 40 50 TIME – SECONDS 60 70 80 90 100 TOP SIDE OF PC BOARD CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150 °C (100°C PCB) SOLDER WAVE TEMPERATURE = 245 °C AIR KNIFE AIR TEMPERATURE = 390 °C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 ° SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. 2.60 (0.103) SOLDER RESIST REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS 4.50 (0.178) Y X 0.40 (0.016) X 0.50 (0.020) Y 1.10 (0.043) 1.50 (0.059) DIMENSIONS IN mm (INCHES). X X 0.5 (0.020) Y Y 1.0 (0.039) 2.0 (0.079) 2.0 (0.079) 6.0 (0.236) 3.0 (0.118) 2.8 (0.110) 6.1 (0.240) DIMENSIONS IN mm (INCHES). REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS |
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