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AMMP-6222-TR1G Datasheet(PDF) 11 Page - AVAGO TECHNOLOGIES LIMITED |
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AMMP-6222-TR1G Datasheet(HTML) 11 Page - AVAGO TECHNOLOGIES LIMITED |
11 / 12 page Figure 24. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste Manual Assembly • Follow ESD precautions while handling packages. • Handling should be along the edges with tweezers. • Recommended attachment is conductive solder paste. Please see recommended solder reflow profile. Neither Conductive epoxy or hand soldering is recommended. • Apply solder paste using a stencil printer or dot placement. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical and electrical performance. • Follow solder paste and vendor’s recommendations when developing a solder reflow profile. A standard profile will have a steady ramp up from room temperature to the pre-heat temp. to avoid damage due to thermal shock. • Packages have been qualified to withstand a peak temperature of 260°C for 20 seconds. Verify that the profile will not expose device beyond these limits. 0 50 100 150 200 250 300 0 50 100 150 200 250 300 Seconds Peak = 250 ± 5˚C Ramp 1 Preheat Ramp 2 Reflow Cooling Melting point = 218˚C A properly designed solder screen or stencil is required to ensure optimum amount of solder paste is deposited onto the PCB pads. The recommended stencil layout is shown in Figure 23. The stencil has a solder paste deposition opening approximately 70% to 90% of the PCB pad. Reducing stencil opening can potentially generate more voids underneath. On the other hand, stencil openings larger than 100% will lead to excessive solder paste smear or bridging across the I/O pads. Considering the fact that solder paste thickness will directly affect the quality of the solder joint, a good choice is to use a laser cut stencil composed of 0.127mm (5 mils) thick stainless steel which is capable of producing the required fine stencil outline. The most commonly used solder reflow method is accomplished in a belt furnace using convection heat transfer.The suggested reflow profile for automated reflow processes is shown in Figure 24. This profile is designed to ensure reliable finished joints. However, the profile indicated in Figure 14 will vary among different solder pastes from different manufacturers and is shown here for reference only. Package, Tape & Reel, and Ordering Information AMMP-6222 Part Number Ordering Information Part Number Devices Per Container Container AMMP-6222-BLKG 0 Antistatic bag AMMP-6222-TRG 00 7”Reel AMMP-6222-TR2G 500 7”Reel |
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