TISP83121D

DUAL-GATE UNIDIRECTIONAL OVERVOLTAGE PROTECTOR

6

FEBRUARY 1999

P R ODUCT I N FORMA T ION

MECHANICAL DATA

D008

plastic small-outline package

This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic

compound. The compound will withstand soldering temperature with no deformation, and circuit performance

characteristics will remain stable when operated in high humidity conditions. Leads require no additional

cleaning or processing when used in soldered assembly.

5,21 (0.205)

4,60 (0.181)

NOTES: A. Leads are within 0,25 (0.010) radius of true position at maximum material condition.

B. Body dimensions do not include mold flash or protrusion.

C. Mold flash or protrusion shall not exceed 0,15 (0.006).

D. Lead tips to be planar within ±0,051 (0.002).

1,75 (0.069)

1,35 (0.053)

6,20 (0.244)

5,80 (0.228)

5,00 (0.197)

4,80 (0.189)

D008

8

765

4

3

2

1

4,00 (0.157)

3,81 (0.150)

7° NOM

3 Places

7° NOM

4 Places

0,51 (0.020)

0,36 (0.014)

8 Places

Pin Spacing

1,27 (0.050)

(see Note A)

6 Places

1,12 (0.044)

0,51 (0.020)

4° ± 4°

0,79 (0.031)

0,28 (0.011)

0,203 (0.008)

0,102 (0.004)

ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES

Designation per JEDEC Std 30:

PDSO-G8

0,50 (0.020)

0,25 (0.010)

x 45°NOM

0,229 (0.0090)

0,190 (0.0075)

MDXXAA