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R5220K311B Datasheet(PDF) 6 Page - RICOH electronics devices division |
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R5220K311B Datasheet(HTML) 6 Page - RICOH electronics devices division |
6 / 25 page R5220x 6 TYPICAL APPLICATION 1 2 3 COUT 10 µF Lx GND 4 5 MODE CE VIN VIN CIN 10 µF L 4.7 µH Load VOUT 6 R5220x Series Parts Recommendation CIN 10 µF Ceramic Capacitor C2012JB0J106K (TDK) COUT 10 µF Ceramic Capacitor C2012JB0J106K (TDK) L 4.7 µH VLP5610-4R7(TDK) External Components • Set external components such as an inductor, CIN, COUT as close as possible to the IC, in particular, minimize the wiring to VIN pin and GND pin. If VDD line or GND line’s impedance is high, the internal voltage level of the IC may fluctuate and the operation may be unstable. Make GND line and VDD line sufficient. Through the VDD line, the GND line, the inductor, Lx pin, and VOUT line, a large current caused by switching may flow, therefore, those lines should be sufficient and avoid the cross talk with other sensitive lines. Use the individual line from the VOUT pin of the IC for the inductor and the capacitor and load. • Use a low ESR ceramic capacitor COUT/CIN with a capacity of 10µF or more. • Select an inductor with an inductance range from 4.7µH to 10µH. The internal phase compensation is secured with these inductance values and COUT value. Choose the inductor with a low DC resistance and enough permissible current and hard to reach magnetic saturation. In terms of inductance value, choose the appropriate value with considering the conditions of the input voltage range and the output voltage, and load current. If the inductance value is too small and the load current is large, the peak current of Lx may reach the Lx current limit, and the protection against over-current may work. • The protection circuit against over-current is affected by the self-heating and the heat radiation environment. Therefore evaluate under the considerable environment of the application. The performance of power source circuits using these ICs extremely depends upon the peripheral circuits. Pay attention in the selection of the peripheral circuits. In particular, design the peripheral circuits in a way that the values such as voltage, current, and power of each component, PCB patterns and the IC do not exceed their respected rated values. |
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