11

JANUARY 1999 - REVISED MAY 1999

TISP3070H3SL THRU TISP3095H3SL, TISP3125H3SL THRU TISP3210H3SL

TISP3250H3SL THRU TISP3350H3SL

DUAL BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS

PR O D UC T

I N FO R M A T IO N

MECHANICAL DATA

SL003

3-pin plastic single-in-line package

This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic com-

pound. The compound will withstand soldering temperature with no deformation, and circuit performance charac-

teristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or

processing when used in soldered assembly.

NOTES: A. Each pin centerline is located within 0,25 (0.010) of its true longitudinal position.

B. Body molding flash of up to 0,15 (0.006) may occur in the package lead plane.

1,854 (0.073) MAX

0,711 (0.028)

0,559 (0.022)

3 Places

12

3

Pin Spacing

2,54 (0.100) T.P.

(see Note A)

2 Places

12,9 (0.492)

MAX

4,57 (0.180)

MAX

6,60 (0.260)

6,10 (0.240)

0,356 (0.014)

0,203 (0.008)

3 Places

SL003

10,2 (0.400) MAX

8,31 (0.327)

MAX

4,267 (0.168)

MIN

ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES

Index

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MDXXAD