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4

TGC4405

Oct 2006 © Rev -

Table IV

Power Dissipation and Thermal Properties

Parameter

Test Conditions

Value

Notes

Maximum Power Dissipation

Tbaseplate = 70 ºC

Pd = 2.9 W

Tchannel = 150 ºC

Tm = 1.0E+6 Hrs

1/ 2/

Thermal Resistance, θjc

Vd = 5 V

Id = 425 mA

Pd = 2.13 W

θjc = 27.4 (ºC/W)

Tchannel = 128 ºC

Tm = 7E+6 Hrs

Mounting Temperature

30 Seconds

320 ºC

Storage Temperature

-65 to 150 ºC

1/

For a median life of 1E+6 hours, Power Dissipation is limited to

Pd(max) = (150 ºC – Tbase ºC)/θjc.

2/

Channel operating temperature will directly affect the device median time to failure (MTTF). For

maximum life, it is recommended that channel temperatures be maintained at the lowest possible

levels.

Power De-rating Curve

0

1

2

3

4

5

6

7

-50 -25

0

25 50 75 100 125 150 175

Baseplate Temp (C)

Tm= 1.0E+6 Hrs