BH616UV1611

R0201-BH616UV1611

Revision

1.3

Otc.

2006

10

n ORDERING INFORMATION

Note:

Brilliance Semiconductor Inc. (BSI) assumes no responsibility for the application or use of any product or circuit described herein. BSI does

not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result

in significant injury or death, including life-support systems and critical medical instruments.

n PACKAGE DIMENSIONS

PACKAGE

D: Dice

B: BGA-48-0810

T: TSOP I-48

BH616UV1611

X

X

Z

Y Y

GRADE

I: -40

SPEED

55: 55ns

70: 70ns

PKG MATERIAL

-: Normal

G: Green, RoHS Compliant

P: Pb free, RoHS Compliant

48 mini-BGA (8 x 10mm)

3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.

1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS.

2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.

N

E

D

NOTES:

48

10.0

8.0

E1

D1

e

3.75

5.25

0.75

SIDE VIEW

D

0.1

D1

SOLDER BALL

0.35 ± 0.05

VIEW A