Part Name
         Description
HDB101G

 1.0 AMP. Glass Passivated Bridge High Efficient Rectifiers ( 2 Page)


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Dimensions in inches and (millimeters)
Version: A06
HDB(S)101G - HDB(S)107G
1.0 AMP. Glass Passivated
Bridge High Efficient Rectifiers
DB
DBS
.404(10.3)
.386(9.80)
.255(6.5)
.245(6.2)
.013(0.33)
.0088(0.22)
.013(0.33)
.003(0.076)
.060(1.53)
.040(1.02)
.205(5.2)
.195(5.0)
.047(1.20)
.040(1.02)
.335(8.51)
.320(8.13)
0
45
.130(3.30)
.120(3.05)
Features
UL Recognized File # E-96005
Glass passivated junction
Ideal for printed circuit board
Reliable low cost construction utilizing molded
plastic technique
High temperature soldering guaranteed:
260oC / 10 seconds / 0.375” ( 9.5mm )
lead length at 5 lbs., ( 2.3 kg ) tension
Small size, simple installation
Leads solderable per MIL-STD-202, Method
208
High surge current capability
Maximum Ratings and Electrical Characteristics
Rating at 25 oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
HDB
101G
HDB
102G
HDB
103G
HDB
104G
HDB
105G
HDB
106G
HDB
107G
Type Number
Symbol
HDBS
101G
HDBS
102G
HDBS
103G
HDBS
104G
HDBS
105G
HDBS
106G
HDBS
107G
Units
Maximum Recurrent Peak Reverse Voltage
VRRM
50
100
200
400
600
800
1000
V
Maximum RMS Voltage
VRMS
35
70
140
280
420
560
700
V
Maximum DC Blocking Voltage
VDC
50
100
200
400
600
800
1000
V
Maximum Average Forward Rectified Current
@TA = 40
oC
I(AV)
1.0
A
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated Load
(JEDEC method )
IFSM
50
A
Maximum Instantaneous Forward Voltage
@ 1.0A
VF
1.0
1.3
1.7
V
Maximum DC Reverse Current @ TA=25
oC
at Rated DC Blocking Voltage @ TA=125
oC
IR
5.0
500
uA
uA
Maximum Reverse Recovery Time ( Note 2 )
Trr
50
75
nS
Typical Thermal Resistance
( Note 3 )
RθJA
RθJL
40
15
oC/W
Operating Temperature Range
TJ
-55 to +150
oC
Storage Temperature Range
TSTG
-55 to +150
oC
Notes:
1. DBS for Surface Mount Package.
2. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A.
3. Thermal Resistance from Junction to Ambient and from Junction to Lead Mounted on
P.C.B. with 0.2” x 0.2”” (5 x 5mm) Copper Pads



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