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February 23, 2006 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200044 Rev. C

DATA SHEET • SMP1304 SERIES

4

4

31

2

43

12

SMP1304-019 (PI)

SMP1304-007

In the -007 configuration of the SOT-23 package, the package

inductance is effectively reduced to 0.4 nH, in comparison to the

1.5 nH value of the standard configuration. This lower inductance

will be particularly beneficial when the diodes are used as shunt

connected switches at frequencies higher than 500 MHz, where

inductance is the primary limitation on maximum switch isola-

tion. To achieve the effective 0.4 nH, the SOT-23 package must

be inserted in the microstrip circuit board with a gap in the trace,

as shown in the figure. Because of the polarity of the diode junc-

tion, this low inductance feature is realizable only with the

cathode connected to ground.

SMP1304-019 PI Attenuator PIN Diodes

The SMP1304-019 employs three PIN diode junctions in a

SOT-143 package. They are configured for ease of insertion in

PI attenuator circuits commonly used from 10 MHz to beyond

1 GHz. The SMP1304 PIN diode junction was designed for low

capacitance, wide resistance dynamic range, and low distortion

performance.

RR

R

R

R

-55 °C

-15 °C

25 °C

65 °C

100 °C

(mA)

(

Ω

Ω)(Ω

Ω)(Ω

Ω)(Ω

Ω)(Ω

Ω)

0.02

1590

1660

1752

1770

1760

0.1

315

340

367

396

409

0.3

108

118

128

141

147

1

34.5

37.9

41.6

46.3

48.8

10

4.8

5.3

5.8

6.6

7

20

3

3.3

3.6

4.1

4.3

100

1.3

1.4

1.5

1.7

1.8

Resistance vs. Temperature @ 100 MHz

Ground

Gap

Recommended Solder Reflow Profiles

Refer to the “Recommended Solder Reflow Profile”

Application Note.

Tape and Reel Information

Refer to the “Discrete Devices and IC Switch/Attenuators

Tape and Reel Package Orientation” Application Note.