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S114D-18 Datasheet(PDF) 1 Page - Teledyne Technologies Incorporated |
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S114D-18 Datasheet(HTML) 1 Page - Teledyne Technologies Incorporated |
1 / 3 page UNIFRAME ARMATURE UPPER STATIONARY CONTACT MOVING CONTACT LOWER STATIONARY CONTACT 56 SERIES S114 CENTIGRID® SURFACE MOUNT AEROSPACE RELAY DPDT TELEDYNE RELAYS SERIES DESIGNATION RELAY TYPE S114 DPDT basic relay S114D DPDT relay with internal diode for coil suppression S114DD DPDT relay with internal diodes for coil transient suppression and polarity reversal protection DESCRIPTION The S114 Series Surface Mount Centigrid ® Relay is an ultraminiature, hermetically sealed, armature relay. The low profile height (.360”) and .100” lead spacing make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The specially formed leads are pre-tinned to make the relays ideal for most types of surface mount solder reflow processes. The basic design and internal construction are identical to the 114 Series Centigrid® relays, and are capable of meeting Teledyne Relays T 2R® requirements. The following unique construction features and manufacturing techniques provide overall high reliability and excellent resistance to environmental extremes: • All welded construction. • Unique uni-frame design providing high magnetic efficiency and mechanical rigidity. • High force/mass ratios for resistance to shock and vibration. • Advanced cleaning techniques provide maximum assurance of internal cleanliness. • Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities. The S114D and S114DD Series utilize internal discrete silicon diodes for coil suppression and polarity reversal protection. By virtue of its inherently low intercontact capacitance and contact circuit losses, the S114 relay has shown itself to be an excellent ultraminiature RF switch for frequency ranges well into the UHF spectrum. A typical RF application for the S114 relay is in hand held radio transceivers, wherein the combined features of good RF performance, small size, low coil power dissipation and high reliability make it a preferred method of transmit-receive switching (see Figure 1). INTERNAL CONSTRUCTION Temperature -65°C to +125°C (Ambient) Vibration 30 g’s to 3000 Hz (Note 3) Shock 75 g’s for 6 msec. (Note 3) half-sine Acceleration 50 g’s (Note 3) Enclosure All welded, hermetically sealed Weight 0.07 oz (1.9 gms.) max. Reflow 260°C max. temp. Temperature 5 min. max. above 180°C ENVIRONMENTAL AND PHYSICAL SPECIFICATIONS |
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