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RC64475 Datasheet(PDF) 6 Page - Integrated Device Technology |
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RC64475 Datasheet(HTML) 6 Page - Integrated Device Technology |
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6 / 25 page  6 of 25 April 10, 2001 RC64474™ RC64475™ Power Management Executing the WAIT instruction enables the processor to enter Standby mode. The internal clocks will shut down, thus freezing the pipeline. The PLL, internal timer, and some of the input pins (Int[5:0]*, NMI*, ExtReq*, Reset*, and ColdReset*) will continue to run. Once the CPU is in Standby Mode, any interrupt, including the internally gener- ated timer interrupt, will cause the CPU to exit Standby Mode. Thermal Considerations The RC64474/475 come in a QFP with a drop-in heat spreader and are guaranteed in a case temperature range of 0 ° to +85° C, for commercial temperature devices; - 40 ° to +85° for industrial tempera- ture devices. The type of package, speed (power) of the device, and airflow conditions affect the equivalent ambient temperature conditions that will meet this specification. The equivalent allowable ambient temperature, TA, can be calculated using the thermal resistance from case to ambient ( ∅CA) of the given package. The following equation relates ambient and case tempera- tures: TA = TC - P * ∅CA where P is the maximum power consumption at hot temperature, calculated by using the maximum ICC specification for the device. Typical values for ∅CA at various airflows are shown in Table 4. Note that the RC64474/475 processors implement advanced power manage- ment, which substantially reduces the typical power dissipation of the device. Data Sheet Revision History December 1998: Changed ordering code on 128-pin package from DQ / DQI (Industrial) to DZ / DZI (Industrial). January 1999: Removed 5V tolerance capability and deleted 5V tolerant pin. February 1999: Changed the package drawings to reflect the new 208-pin DP (DPI) and 128-pin DZ (DZI) packages. May 1999: Removed “Preliminary” status from data sheet. Changes in DC Electrical Characteristics table. Changes in Pin Description table. Changes in Clock Parameters table. Changes in System Interface Parameters table. September 1999: Updated Revision History section. ∅CA Airflow (ft/min) 0 200 400 600 800 1000 128 QFP 16 10 9 7 6 5 208 QFP 20 13 10 9 8 7 Table 4 Thermal Resistance ( ∅CA) at Various Airflows January 17, 2000: Added “with DSP extensions” in the CPU row under RC64574 and RC64575 columns in Table 1. Added “lockable by line” in the Caches row under RC64574 and RC64575 columns in Table 1. Revised Data Output and Data Output Hold rows in System Interface Parameters table. February 10, 2000: Revised values in Table 4, Thermal Resistance. Old values were: March 13, 2000: Replaced existing figure in Mode Configuration Interface Reset Sequence section with 3 reset figures. March 28, 2000: Removed the symbol tDZ from Figure 3. April 17, 2000: Changed VIH value in 200MHz column from 2.0V to 0.7VCC. April 10, 2001: In the Data Output and Data Output Hold categories of the System Interface Parameters table, changed values in the Min column for all speeds from 1.0 to 0. Deleted Output for Loading AC Testing diagram and added Output Loading for AC Timing diagram (Figure 8). ∅CA Airflow (ft/min) 0 200 400 600 800 1000 128 QFP 20 12 9 8 7 6 208 QFP 20 12 9 8 7 6 |
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