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IDT70P3517S233RM Datasheet(PDF) 3 Page - Integrated Device Technology

Part # IDT70P3517S233RM
Description  512K/256K x36 SYNCHRONOUS DUAL QDR-II
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

IDT70P3517S233RM Datasheet(HTML) 3 Page - Integrated Device Technology

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18/9Mb x36 IDT70P3537/70P3517
SYNCHRONOUS Dual QDR-IITM
Preliminary Datasheet
Commercial Temperatue Range
3
July 16, 2007
Functional Description
As a memory standard, the (Quad Data Rate) QDR-II SRAM
interface has become increasingly common in high performance
networking systems. With the QDR-II interface/configuration, memory
throughput is increased without increasing the clock rate via the use
of two unidirectional buses on each of providing 2 ports of QDR-II
makes this a Dual-QDRII Static Ram two ports to transfer data without
the need for bus turnaround.
Dual QDR-II Static RAMs are high speed synchronous mem-
ories supporting two independent double-data-rate (DDR) read and
write data ports. This scheme allows simultaneous read and write
access for the maximum device throughput - two data items are
passed with each read or write. Four data word transfers occur per
clock cycle, providing quad-data-rate (QDR) performance on each
port. Comparing this with standard SRAM common I/O single data
rate (SDR) devices, a four to one increase in data access is achieved
at equivalent clock speeds. IDT70P3537/70P3517 Dual QDR-II Static
RAM devices, are capable of sustaining full bandwidth on both the
input and output buses simultaneously. Using independent buses for
read and write data access simplifies design by eliminating the need
for bidirectional buses. And all data are in two word bursts, (with
addressing capability to the burst level).
Devices with QDR-II interfaces include network processor units
(NPUs) and field programmable gate arrays (FPGAs).
IDT70P3537/70P3517 Dual QDR-II Static RAMs support uni-
directional 36-bit read and write interfaces. These data inputs and
outputs operate simultaneously, thus eliminating the need for high-
speed bus turnarounds (i.e. no dead cycles are present). Access to
each port is accomplished using a common 18-bit address bus (17
bits for IDT70P3517). Addresses for reads and writes are latched on
rising edges of the K and K input clocks, respectively.The K and K
clocks are offset by 90 degrees or half a clock cycle. Each address
location is associated with two 36-bit data words that burst sequentially
into or out of the device. Since data can be transferred into and out
of the device on every rising edge of the K and K clocks, memory
bandwidth is maximized while simplifying overall design through the
elimination of bus turnaround(s). IDT70P3537/70P3517 Dual QDR-II
Static RAMs can support devices in a multi-drop configuration (i.e.
multiple devices connected to the same interface). Through this
capability, system designers can support compatible devices such as
NPUs and FPGAs on the same bus at the same time.
Using independent ports for read and write access simplifies
design by eliminating the need for bidirectional buses. All buses
associated with Dual QDR-II Static RAMs are unidirectional and can
be optimized for signal integrity at very high bus speeds. The Dual
QDR-II Static RAM has scalable output impedance on its data output
bus and echo clocks allowing the user to tune the bus for low noise
and high performance.
IDT70P3537/70P3517 Dual QDR-II Static RAMs have a single
DDR address bus per port with multiplexed read and write addresses.
All read addresses are received on the first half of the clock cycle and
all write addresses are received on the second half of the clock cycle.
The byte write signals are received on both halves of the clock cycle
simultaneously with the data they are controlling on the data input bus.
The Dual QDR-II Static RAM device has echo clocks, which
provide the user with a clock that is precisely timed to the data output
and tuned with matching impedance and signal quality. The user
can use the echo clock for downstream clocking of the data. For
the user, echo clocks eliminate the need to produce alternate clocks
with precise timing, positioning, and signal qualities to guarantee
data capture. Since the echo clocks are generated by the same
source that drives the data output, the relationship to the data is
NOT significantly affected by external parameters such as voltage,
temperature, and process as would be the case if the clock were
generated by an outside source.Thus the echo clocks are guaran-
teed to be synchronized with the data.
All interfaces of Dual QDR-II Static RAMs are HSTL, allow-
ing speeds beyond SRAM devices that use any form of TTL
interface. The interface can be scaled to higher voltages (up to
1.9V) to interface with 1.8V systems, if necessary. The device has
VDDQ pins and a separate Vref, allowing the user to designate the
interface operational voltage independent of the device core volt-
age of 1.8V VDD. Output impedance control pins allow the user to
adjust the drive strength to adapt to a wide range of loads and
transmission lines.
Clocking
The IDT70P3537/3517 has two sets of input clocks for both
the input and output, the K, K clocks and the C, C clocks. In addition,
the IDT70P3537/3517 has an output “echo” clock pair, CQ and CQ.
The K and K clocks are the primary device input clocks.
The K clock is used to clock in the control signals (R, W, E[1:0],
BW
0-3), the read address, and the first word of the data burst
(D[35:0]) during a write operation. The K clock is used to clock in
the control signals (BW0-3, E[1:0]), write address and the second
word of the data burst during a write operation (D[35:0]). In the
event that the user disables the C and C clocks, the K and K clocks
will also be used to clock the data out of the output register and
generate the echo clocks. The K and K, C and C,CQ and CQ, pairs
are offset by half a clock cycle from each other.
The C and C clocks may be used to clock the data out of
the output register during read operations and to generate the echo
clocks. C and C must be presented to the memory within the timing
tolerances as shown in the AC Electrical Characteristics Table
(Page 12). The output data from the IDT70P3537/70P3517 will be
closely aligned to the C and C input, through the use of an internal
DLL. When C is presented to the IDT70P3537/70P3517 the DLL
will have already internally clocked the data to arrive at the device
output simultaneously with the arrival of the C clock. The C and
second data item of the burst will also correspond.
Single Clock Mode
The IDT70P3537/70P3517 may be operated with a single
clock pair. C and C may be disabled by tying both signals high,
forcing the outputs and echo clocks to be controlled instead by the
K and K clocks.
DLL Operation
The DLL in the output structure of the IDT70P3537/70P3517
can be used to closely align the incoming clocks C and C with the
output of the data, generating very tight tolerances between the


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