Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Solder Reflow Recommendations

160–220

300

250

200

150

100

50

0

10–20

120

Preheating

Soldering

Cooling

Time (seconds)

Solder reflow

• Recommended reflow methods: IR, vapor phase oven, hot air oven.

• Devices are not designed to be wave soldered to the bottom side of the

board.

• Gluing the devices is not recommended.

• Recommended maximum paste thickness is 0.25 mm (.010 inch).

• Devices can be cleaned using standard industry methods and solvents.

Note:

• If reflow temperatures exceed the recommended profile, devices may not

meet the performance requirements.

Rework

• A device should not be reworked.

CMF-SD Series - Telecom CPTC Resettable Fuses

Asia-Pacific:

Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116

Europe:

Tel: +41-41 768 5555 • Fax: +41-41 768 5510

The Americas:

Tel: +1-951 781-5500 • Fax: +1-951 781-5700

www.bourns.com

Reliable Electronic Solutions

CMF-SD SERIES, REV. F, 08/07