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SSC-UBMGFRT722 Datasheet(PDF) 7 Page - Seoul Semiconductor |
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SSC-UBMGFRT722 Datasheet(HTML) 7 Page - Seoul Semiconductor |
7 / 12 page 7. Soldering Profile (1) Reflow Soldering Conditions / Profile . * Condition (2) Lead-free solder * Condition (3) Reflow soldering should not be done more than two times. (4) Hand Soldering conditions Do not exceed 3 seconds at maximum 300ºC under soldering iron. . Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 7/12 - SSC-UBMGFRT722 SSC-QP-7-03-08(REV.11) 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 180~200 C 1~5 C / sec. o o o o 1~5 C / sec. Pre-heat 180~200℃ Pre-heat time 120 sec. Max. P ak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. Lead-free Solder e 1~ Pre-heat 130~160℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. Lead Solder 1~5 C / sec. o o o o 5 C / sec. Pre-heating 130~160 C 120sec. Max. 60sec. Max. Above 210 C o 240 C Max. 10 sec. Max. |
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Similar Description - SSC-UBMGFRT722 |
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