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AN231E04-E2-QFNSP Datasheet(PDF) 4 Page - List of Unclassifed Manufacturers

Part # AN231E04-E2-QFNSP
Description  Dynamically Reconfigurable dpASP
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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AN231E04 Datasheet – Dynamically Reconfigurable dpASP
DS231000-U001d
- 4 -
1
ELECTRICAL CHARACTERISTICS
1.1
Absolute Maximum Ratings
Parameter
Symbol
Min
Typ
Max
Unit
Comment
DC Power Supplies
a
AVDD
BVDD
DVDD
-0.5
-
3.6 V
V
AVSS, BVSS and DVSS all held
to 0.0 V
xVDD to yVDD Offset
-0.5
0.5
V
Ideally all supplies should be at
the same voltage
Package Power Dissipation,
Pmax 25°C
Pmax 85°C
-
-
4.5
1.8
W
(Theoretical values based on
Tj=125deg.C)
Still air, No heatsink, 44 pads and
exposed die pad soldered to PCB
θja = 22.5°C/W. VDD = 3.3V
AN231E04 max power
dissipation
dpASPmax
-
-
0.25
W
Maximum power dissipation all
resources used, (see section
1.5.13 for more detail).
Input Voltage
Vinmax
VSS-0.5
-
VDD+0.5
V
Ambient Operating
Temperature
Top
-40
-
85
°C
Storage Temperature
Tstg
-40
125
°C
a
Absolute Maximum DC Power Supply Rating - The failure mode is non-catastrophic for VDD of up to 5 volts, but will cause
reduced operating life time. The additional stress caused by higher local electric fields within the CMOS circuitry may induce
metal migration, oxide leakage and other time/quality related issues.
1.2
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Comment
DC Power Supplies
AVDD
BVDD
DVDD
3.0
3.3
3.6
V
AVSS, BVSS and DVSS all held
to 0 V
Analog Input Voltage.
Vina
VMR
-1.375
-
VMR
+1.375
V
Conditional on the circuit which is
being driven. This limit is defined
as maximum signal amplitude
through input Sample and hold
cell which results in >-80dB
THD+N using a 1KHz test signal.
VMR is 1.5 volts above AVSS
Digital Input Voltage
Vind
0
-
DVDD
V
Junction Temp
b
Tj
-40
-
125
°C
Assume a package
θja=22.5°C/W
b
To calculate the junction temperature (Tj) you must first empirically determine the current draw (total Idd) for the design. The
programmable nature of this device means this can vary by orders of magnitude between different circuit designs. Once the current
consumption is established then the following formula can be used; Tj = Ta + Idd x VDD x 22.5 °C/W, where Ta is the ambient
temperature. Worst case
θja = 22.5 °C/W assumes no air flow and no additional heatsink, 44 pads and the exposed die pad soldered
to PCB.
1.3
General Digital I/O Characteristics (VDD = 3.3v +/- 10%, -40 to 85 deg.C)
Parameter
Symbol
Min
Typ
Max
Unit
Comment
Input Voltage Low
Vih
0
-
30
-
% of DVDD
Input Voltage High
Vil
70
-
100
-
% of DVDD
Output Voltage Low
Vol
0
-
20
-
% of DVDD
Output Voltage High
Voh
80
-
100
-
% of DVDD
Input Leakage Current
Iil
-
-
+/-1
µA
Some pins have active pull
up/down, please see below.
Max. Capacitive Load
Cmax
-
-
10
pF
Min. Resistive Load
Rmin
50
-
-
Kohm
Each pins has a specific load
driving capability, detailed in
sections 1.4 and 1.5
ACLK Frequency
Fmax
-
16
40
MHz
Divide down to <4 MHz prior to
use as a CAB clock
Clock Duty Cycle
CLKduty
45
-
55
%
All clocks


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