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PE83511 Datasheet(PDF) 2 Page - Peregrine Semiconductor Corp.

Part # PE83511
Description  DC - 1500 MHz Low Power UltraCMOS Divide-by-2 Prescaler Military Operating Temperature Range
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Manufacturer  PEREGRINE [Peregrine Semiconductor Corp.]
Direct Link  http://www.peregrine-semi.com
Logo PEREGRINE - Peregrine Semiconductor Corp.

PE83511 Datasheet(HTML) 2 Page - Peregrine Semiconductor Corp.

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Product Specification
PE83511
Page 2 of 7
©2003-2006 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0113-03
│ UltraCMOS™ RFIC Solutions
Table 3. Absolute Maximum Ratings
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS™ device, observe
the same precautions that you would use with
other ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the rating specified in Table 3.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS™
devices are immune to latch-up.
Figure 3. Pin Configuration (Top View)
Device Functional Considerations
The PE83511 divides an input signal, up to a
frequency of 1500 MHz, by a factor of two thereby
producing an output frequency at half the input
frequency. To work properly at higher frequency,
the input and output signals (pins 2, 7 & optional
5) must be AC coupled via an external capacitor.
The input may be DC coupled for low frequency
operation with care taken to remain within the
specified DC input range for the device.
The ground pattern on the board should be made
as wide as possible to minimize ground
impedance. See Figure 8 for a layout example.
OUTB Control
Pin 6 controls whether OUTB is enabled or
disabled. Pin 6 has an internal pull-up resistor.
With no connection (floating), OUTB is disabled.
By grounding pin 6, OUTB is enabled. By
enabling OUTB, this part will consume roughly
5 mA more current.
Absolute Maximum Ratings are those values
listed in the above table. Exceeding these values
may cause permanent device damage. Exposure
to absolute maximum ratings for extended periods
may affect device reliability.
Table 2. Pin Descriptions
8
PE83511
1
2
3
4
7
6
5
IN
GND
N/C
GND
OUT
VDD
CTL
OUT
8
Pin
No.
Pin
Name
Description
1
VDD
Power supply pin. Bypassing is required
(eg 1000 pF & 100 pF).
2
IN
Input signal pin. Should be coupled with a
capacitor (eg 1000 pF).
3
N/C
No connection. This pin should be left open.
4
GND
Ground pin. Ground pattern on the board
should be as wide as possible to reduce
ground impedance.
5
OUTB
Inverted divided frequency output. This pin
should be coupled with a capacitor
(eg 1000 pF).
6
CTL
Control pin. When grounded OUTB is
enabled.
7
OUT
Divided frequency output. This pin should
be coupled with a capacitor (eg 1000 pF).
8
GND
Ground Pin.
Symbol
Parameter/Conditions
Min
Max
Units
VDD
Supply voltage
4.0
V
Pin
Input Power
15
dBm
VIN
Voltage on input
-0.3
VDD
+0.3
V
TST
Storage temperature range
-65
150
°C
TOP
Operating temperature
range
-55
125
°C
VESD
ESD voltage (Human Body
Model, MIL-STD 883)
2000
V


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