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74LVC1G34GW Datasheet(PDF) 2 Page - NXP Semiconductors |
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74LVC1G34GW Datasheet(HTML) 2 Page - NXP Semiconductors |
2 / 15 page 74LVC1G34_2 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 — 21 May 2007 2 of 15 NXP Semiconductors 74LVC1G34 Single buffer 3. Ordering information 4. Marking 5. Functional diagram Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC1G34GW −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 74LVC1G34GV −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753 74LVC1G34GM −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 × 1.45 × 0.5 mm SOT886 74LVC1G34GF −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 × 1 × 0.5 mm SOT891 Table 2. Marking Type number Marking code 74LVC1G34GW YN 74LVC1G34GV YN 74LVC1G34GM YN 74LVC1G34GF YN Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram 001aac538 2A 4 Y 001aac537 24 001aac536 Y A |
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