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R5F21228DFP Datasheet(PDF) 1 Page - Renesas Technology Corp |
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R5F21228DFP Datasheet(HTML) 1 Page - Renesas Technology Corp |
1 / 52 page Rev.1.10 Mar 16, 2007 Page 1 of 48 REJ03B0097-0110 R8C/22 Group, R8C/23 Group RENESAS MCU 1. Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and suited to in-vehicle or FA networking. Furthermore, the data flash (1 KB x 2 blocks) is embedded in the R8C/23 Group. The difference between R8C/22 and R8C/23 Groups is only the existence of the data flash. Their peripheral functions are the same. 1.1 Applications Automotive, etc. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 |
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