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MCP1603 Datasheet(PDF) 4 Page - Microchip Technology

Part # MCP1603
Description  2.0 MHz, 500 mA Synchronous Buck Regulator
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP1603 Datasheet(HTML) 4 Page - Microchip Technology

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MCP1603
DS22042A-page 4
© 2007 Microchip Technology Inc.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VIN - GND.......................................................................+6.0V
All Other I/O ...............................(GND - 0.3V) to (VIN + 0.3V)
LX to GND .............................................. -0.3V to (VIN + 0.3V)
Output Short Circuit Current..................................Continuous
Power Dissipation (Note 5) ..........................Internally Limited
Storage Temperature.....................................-65°C to +150°C
Ambient Temp. with Power Applied.................-40°C to +85°C
Operating Junction Temperature...................-40°C to +125°C
ESD Protection On All Pins:
HBM..............................................................................4 kV
MM...............................................................................300V
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational sections of this specification is not intended.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V,
IOUT = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Characteristics
Input Voltage
VIN
2.7
5.5
V
Note 1
Maximum Output Current
IOUT
500
——
mA
Note 1
Shutdown Current
IIN_SHDN
0.1
1
µA
SHDN = GND
Quiescent Current
IQ
—45
60
µA
SHDN = VIN, IOUT = 0 mA
Shutdown/UVLO/Thermal Shutdown Characteristics
SHDN, Logic Input Voltage Low
VIL
——
15
%VIN VIN = 2.7V to 5.5V
SHDN, Logic Input Voltage High
VIH
45
——
%VIN VIN = 2.7V to 5.5V
SHDN, Input Leakage Current
IL_SHDN
-1.0
±0.1
1.0
µA
VIN = 2.7V to 5.5V
Undervoltage Lockout
UVLO
2.12
2.28
2.43
VVIN Falling
Undervoltage Lockout Hysteresis UVLOHYS
140
mV
Thermal Shutdown
TSHD
150
°C
Note 4, Note 5
Thermal Shutdown Hysteresis
TSHD-HYS
—10
°C
Note 4, Note 5
Note 1: The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VOUT + 0.5V.
2: Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.
3: VR is the output voltage setting.
4: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
temperature and the thermal resistance from junction to air (i.e. TA, TJ, θJA). Exceeding the maximum
allowable power dissipation causes the device to initiate thermal shutdown.
5: The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin
to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits
must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.
6: The current limit threshold is a cycle-by-cycle peak current limit.


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