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MCP1603 Datasheet(PDF) 4 Page - Microchip Technology |
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MCP1603 Datasheet(HTML) 4 Page - Microchip Technology |
4 / 26 page MCP1603 DS22042A-page 4 © 2007 Microchip Technology Inc. 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † VIN - GND.......................................................................+6.0V All Other I/O ...............................(GND - 0.3V) to (VIN + 0.3V) LX to GND .............................................. -0.3V to (VIN + 0.3V) Output Short Circuit Current..................................Continuous Power Dissipation (Note 5) ..........................Internally Limited Storage Temperature.....................................-65°C to +150°C Ambient Temp. with Power Applied.................-40°C to +85°C Operating Junction Temperature...................-40°C to +125°C ESD Protection On All Pins: HBM..............................................................................4 kV MM...............................................................................300V † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Characteristics: Unless otherwise indicated, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, IOUT = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C. Parameters Sym Min Typ Max Units Conditions Input Characteristics Input Voltage VIN 2.7 — 5.5 V Note 1 Maximum Output Current IOUT 500 —— mA Note 1 Shutdown Current IIN_SHDN — 0.1 1 µA SHDN = GND Quiescent Current IQ —45 60 µA SHDN = VIN, IOUT = 0 mA Shutdown/UVLO/Thermal Shutdown Characteristics SHDN, Logic Input Voltage Low VIL —— 15 %VIN VIN = 2.7V to 5.5V SHDN, Logic Input Voltage High VIH 45 —— %VIN VIN = 2.7V to 5.5V SHDN, Input Leakage Current IL_SHDN -1.0 ±0.1 1.0 µA VIN = 2.7V to 5.5V Undervoltage Lockout UVLO 2.12 2.28 2.43 VVIN Falling Undervoltage Lockout Hysteresis UVLOHYS — 140 — mV Thermal Shutdown TSHD — 150 — °C Note 4, Note 5 Thermal Shutdown Hysteresis TSHD-HYS —10 — °C Note 4, Note 5 Note 1: The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VOUT + 0.5V. 2: Reference Feedback Voltage Tolerance applies to adjustable output voltage setting. 3: VR is the output voltage setting. 4: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable temperature and the thermal resistance from junction to air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. 5: The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not able to limit the junction temperature for these cases. 6: The current limit threshold is a cycle-by-cycle peak current limit. |
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