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MF1ICS2005U7D Datasheet(PDF) 7 Page - NXP Semiconductors |
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MF1ICS2005U7D Datasheet(HTML) 7 Page - NXP Semiconductors |
7 / 7 page NXP Semiconductors MF1 IC S20 05 Sawn bumped 120µm wafer addendum © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 18 July 2007 Document identifier: 141130 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 11. Tables Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .1 Table 2. Limiting values[1][2][3] . . . . . . . . . . . . . . . . . . . . . .3 Table 3. Electrical characteristics [1][2][3] . . . . . . . . . . . . . 3 Table 4. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 5 12. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 3 Mechanical specification . . . . . . . . . . . . . . . . . 1 3.1 Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3.2 Wafer backside . . . . . . . . . . . . . . . . . . . . . . . . . 1 3.3 Chip dimensions . . . . . . . . . . . . . . . . . . . . . . . 1 3.4 Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3.5 Au bump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Chip orientation and bond pad locations . . . . 4 7 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6 9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6 9.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Contact information. . . . . . . . . . . . . . . . . . . . . . 6 11 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 |
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