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MHP1400R100J Datasheet(PDF) 1 Page - Bi technologies |
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MHP1400R100J Datasheet(HTML) 1 Page - Bi technologies |
1 / 2 page 140W TO-247 HIGH POWER RESISTORS Features…………………………………………………………. Non-inductive, high power resistor. Thermally enhanced Industry standard TO-247 package. Extremely Low thermal resistance, 0.9 °C/W resistor hot spot to metal tab. Complete thermal flow design available for easy implementation. Small thin package for high density PCB installation. RoHS compliant. Applications……………………………………………………… High frequency circuits and RF power amplifiers. UPS and power supply circuits Motor control and power/RF power amplifiers. Industrial power equipment. PLC drivers. Inrush current protection. Specification Specifications subject to change without notice. Notes: 1. Electrically isolated metal tab. 2. Recommend the use of thermal grease between metal tab and heat sink. 3. Thermal design should account for a thermal resistance between resistor and tab of 0.9 °C/W and a maximum resistor temperature of 155 °C. 4. Resistances greater than 220 Ω are available, please call factory. 5. Current rating: 25A maximum. Items Specification Conditions Power Rating 140 Watts @ Tab Temp < 25 °C Power Rating 5.0 Watts Free air. Resistance Range 0.01-0.09 Ω 0.1-9.1 Ω 10-220 Ω Extended resistance range to 51K Ω avail. Nominal Resistance Series E6 E12 E24 2.0 Ω and 5.0 Ω also available. TCR 250 ppm/ °C 100 ppm/ °C 50 ppm/ °C For -55 to +155 °C Tolerance 5% 5% and 1% 1% Operation Temp. Range -55 - +155 °C Rated Voltage (Max). 700V or √(P*R) Dielectric Withstanding Voltage 2500 Volt 60 seconds. Load Life ∆R +/- (1.0 %+0.05 Ω) 25 °C, 90 min. ON, 30 min.OFF, 1000 hours. Humidity ∆R +/- (1.0 %+0.05 Ω) 40 °C, 90-95% RH, DC 0.1W, 1000 hours. Temperature Cycle ∆R +/- (0.25 %+0.05 Ω) -55 °C, 30 min.,+155°C 30min., 5cycles. Soldering Heat (Max) ∆R +/- (0.25 %+0.05 Ω) 250+/-5 °C, 3 seconds, Solderability Min 95% coverage 230+/-5 °C, 3 seconds. Insulation Resistance Over 1000 M Ω Between terminals and metal back plate. Vibration ∆R +/- (0.25 %+0.05 Ω) Structure and Material Epoxy Molding Copper Wire Leads Conductor Resistor Film Alumina Copper Plate Dimensions (mm) dia.3.2 20 5.1 4.8 16.0 3+/-0.3 10.9 14.5 +/-0.5 dia.0.8 MHP 140 100F 1 |
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