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UM9601 Datasheet(PDF) 11 Page - Microsemi Corporation |
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UM9601 Datasheet(HTML) 11 Page - Microsemi Corporation |
11 / 16 page Microsemi Page 11 Copyright 2005 Rev. 0, 2006-01-17 UM9601 – UM9608 FOR MICROSTRIP 900 MHz ANTENNNA SWITCHES CO S OS AND MICROWAVE APPLICATIONS 10 100 1000 DIODE CURRENT (mA) 6 8 10 12 14 16 18 20 22 24 26 28 ISOLATION vs FREQUENCY AND DIODE CURRENT 0.025" (0.635mm) ALUMINA MICROSTRIP SPST SWITCH TYPICAL UM9601 - UM9604 UM9605 - UM9608 UM9601 - UM9604 UM9605 - UM9608 1 GHz 3 GHz Installation in Microstrip The cup type flange on the UM9601, UM9602, UM9605, and UM9606 is designed to be affixed to the ground plane surface of a microstrip board. The UM9603, UM9604, UM9607, and UM9608 were designed to be affixed to a backing plate as shown. It was experimentally determined that at frequencies greater than 2 GHz the anode of the diode should be approximately 0.010” (.254mm) above the top surface of the microstrip for lowest insertion loss. Figure: UM9601/UM9602 Microstrip Mount Design Example – 900 MHz Antenna Switch An example of a practical circuit design using a UM9601 diode is a quarter-wave antenna switch covering the frequency of 800-900 MHz. The circuit design for this switch is shown and was constructed using 0.025” (0.645mm) alumina microstrip. This antenna switch uses a series mounted diode and a shunt mounted diode. The UM9601 was selected for shunt mounted device (SPST performance at 1 GHz: 0.2dB insertion loss and 25dB isolation) and because it is the lowest cost diode in the UM9601-UM9608 series. A UM9401 axial lead diode was chosen for the series mounted device. The performance of this switch is displayed in the graphs and in the following table. It should be noted that the loss values are actual measured numbers including losses due to the capacitors, bias networks, connectors, as well as the board. In a typical radio application where the antenna switch circuit board is integrated in the same microstrip board that contains transmitter and receiver elements the connector loss is eliminated. This will result in lower overall insertion loss values than indicated here. For solder adhesion the microstrip may be heated to solder melting temperature (up to 300 oC) with no damage to the diode. Conductive epoxy may also be employed. The thermal resistance of solder mounted UM9601-UM9604 in their test boards was less than 20 oC/W; for the UM9605-UM9608 thermal resistance was less than 30 oC/W. |
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