FAST RECOVERY, HIGH POWER,

MICRO, HIGH VOLTAGE RECTIFIERS

Microsemi

Scottsdale Division

8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

Page 1

Copyright

 2004

12-29 2004 REV A

SCOTTSD A L E DIVISION

MC5610 thru MC5619

DESCRIPTION

APPEARANCE

The MC5610 through MC5619 series of fast recovery high voltage silicon

rectifiers feature the smallest packages available. They are ideal for high-

reliability where a failure cannot be tolerated. These 0.275 to 0.790 Amp

rated rectifiers for working peak reverse voltages from 1500 to 5000 volts are

hermetically sealed with voidless-glass construction using an internal

“Category I” metallurgical bond. Typical applications include transmitters,

power supplies, radar equipment and X-ray machines. Surface mount MELF

package configurations are also available by adding “SM” suffix. Microsemi

also offers numerous other rectifier products to meet higher and lower

current ratings with various recovery time speed requirements including fast

and ultrafast device types in both through-hole and surface mount packages.

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

FEATURES

APPLICATIONS / BENEFITS

•

Voidless Hermetically Sealed Glass Package

•

Triple-Layer Passivation

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Internal “Category I” Metallurgical bonds

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Lowest Reverse Leakage Available

•

Lowest Thermal Resistance Available

•

Absolute High Voltage / High Temperature Stability

•

Surface mount equivalents also available in a square

end-cap MELF configuration with “SM” suffix

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High voltage fast recovery rectifiers 1500 to 5000 V

•

Military and other high-reliability applications

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Applications include bridges, half-bridges, catch

diodes, voltage multipliers,

X-ray machines, power

supplies, transmitters, and radar equipment

•

High forward surge current capability

•

Extremely robust construction

•

Inherently radiation hard as described in Microsemi

MicroNote 050

MAXIMUM RATINGS

MECHANICAL AND PACKAGING

•

Operating Temperature Range:

MC5610 – MC5612……-55

MC5613 – MC5616……-65

MC5617 – MC5619……-65

•

Storage Temperature Range: -65

•

Thermal Resistance: 38

inch (10 mm) lead length from body

•

Electrical Characteristics for maximum rating at 55

and 100

•

Forward Surge Current: See Electrical

Characteristics for surge at 8.3 ms half-sine wave

•

Solder Temperatures: 260ºC for 10 s (maximum)

•

CASE: Hermetically sealed voidless hard glass with

Tungsten slugs

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TERMINATIONS: Axial leads are copper with

Tin/Lead (Sn/Pb) finish

•

MARKING: Body paint and part number, etc.

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POLARITY: Cathode band

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TAPE & REEL option: Standard per EIA-296

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WEIGHT: 400 mg (approx)

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See package dimensions on last page

S Package