LX1973A

Microsemi

Integrated Products Division

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 7

Copyright

© 2005

Rev. 1.1, 2006-12-15

Automotive Light Sensor

TM

®

PACKAGE DIMENSIONS

DU

8-Pin Miniature Shrink Outline Package (MSOP)

A1

L

E

L1

E1

b

e

S

A

D

Top View

Side Views

PIN # NAME

1VDD

2N.C.

3N.C.

4OUT

5N.C.

6N.C.

7N.C.

8VSS

12

3

4

5

6

7

8

Dim

MIN

MAX

MIN

MAX

A

–

1.10

–

0.043

A1

0.05

0.15

0.002

0.006

b

0.26

0.41

0.010

0.016

c

0.13

0.23

0.005

0.009

D

2.90

3.10

0.114

0.122

e

0.65 BSC

0.025 BSC

E

4.75

5.05

0.187

0.198

E1

2.90

3.10

0.114

0.122

L

0.41

0.71

0.016

0.028

L1

0.95 BSC

0.037 BSC

S

0.525 BSC

0.021 BSC

Θ

3°

3°

E

A

0.12

E1

D

e

b

A1

c

Ø

L1

L

Dim

MIN

MAX

MIN

MAX

A

-

1.100

-

0.043

A1

0.050

0.150

0.002

0.006

b

0.280

0.380

0.011

0.015

C

0.130

0.230

0.005

0.009

D

2.900

3.100

0.114

0.122

E

4.750

5.050

0.187

0.198

E1

2.900

3.100

0.114

0.122

e

0.650 BSC

0.025 BSC

L

0.406

0.686

0.016

0.027

L1

0.940 REF

0.037 REF

Ø

8°

8°

Note:

Dimensions do not include mold flash or protrusions;

these shall not exceed 0.155mm(.006”) on any side.

Lead dimension shall not include solder coverage.