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LX1673-03CPW Datasheet(PDF) 2 Page - Microsemi Corporation |
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LX1673-03CPW Datasheet(HTML) 2 Page - Microsemi Corporation |
2 / 13 page Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 Copyright © 2004 Rev 1.0, 3/18/2005 LX1673 High Frequency PWM Regulator PRODUCTION DATA SHEET TM ® ABSOLUTE MAXI MUM RATI NGS Supply Voltage (VCC) DC................................................................-0.3V to 5.5V Supply Voltage (VCC) Transient .........................................................-0.3V to 6V Driver Supply Voltage (VCCL) DC .....................................................-0.3V to 13V Driver Supply Voltage (VCCL) Transient............................................-0.3V to 16V Driver Supply Voltage (VC1) DC .......................................................-0.3V to 19V Input Voltage (SS/DIS) .....................................................................-0.3V to 5.5V Output Drive Peak Current Source (HO, LO).......................................1A (500ns) Output Drive Peak Current Sink (HO, LO) ..........................................1A (500ns) Operating Temperature Range .........................................................-40°C to 85°C Maximum Operating Junction Temperature ................................................ 150°C Storage Temperature Range...........................................................-65°C to 150°C Lead Temperature (Soldering 180 seconds) ................................................ 235°C Package Peak Temp. for Solder Reflow (40 Seconds Maximum Exposure).. 260°C(+0, -5) Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal . The limitation on transient time is thermal and is due to zener diodes on the supply pins, application of maximum voltages will increase current into that pin and increase package power dissipation. TH ERM A L DATA PW Plastic TSSOP 20-Pin THERMAL RESISTANCE -JUNCTION TO AMBIENT, θJA 90 °C/W LQ Plastic MLPQ 20-Pin THERMAL RESISTANCE -JUNCTION TO AMBIENT, θ JA 35°C/W Junction Temperature Calculation: TJ = TA + (PD x θJC). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no airflow. PACKAGE PIN OUT LDGD LDFB LDDIS DGND AGND CS VS VCC VCCL BDRV 1 6 11 16 LQ PACKAGE (Top View) N.C. – No Internal Connection N/U – Not Used RSVD – Do Not Use VC1 PGOOD LDOVCC LDGD LDFB LDDIS DGND AGND EAO CS VS VCC VCCL BDRV PGND TDRV 1 10 11 20 DIS SS EA+ EA- PW PACKAGE (Top View) Pb-free 100% Matte Tin Lead Finish |
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