STA3005

Package informations

3/5

Package informations

These packages have a Lead-free second level interconnect. The category of second level

Interconnect is marked on the package and on the inner box label, in compliance with

JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also

marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 1.

TQFP144 Mechanical Data & Package Dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

1.20

0.047

A1

0.05

0.15

0.002

0.006

A2

0.95

1.00

1.05

0.037

0.039

0.041

B

0.17

0.22

0.27

0.007

0.009

0.011

C

0.09

0.20

0.003

0.008

D

21.80

22.00

22.20

0.858

0.866

0.874

D1

19.80

20.00

20.20

0.779

0.787

0.795

D2

2.00

0.079

D3

17.50

0.689

e

0.50

0.020

E

21.80

22.00

22.20

0.858

0.866

0.874

E1

19.80

20.00

20.20

0.779

0.787

0.795

E2

2.00

0.079

E3

17.50

0.689

L

0.45

0.60

0.75

0.018

0.024

0.030

L1

1.00

0.0393

K

3.5˚ (min.), 7˚(max.)

ccc

0.08

0.03

TQFP144

(20x20x1.0mm exposed Pad Down)

7386636

Note 1: Exact shape of each corner is optional.