SYMBOL

FUNCTION

SI

Start Pulse: Input to start the line scan.

CLK

Clock Pulse: Input to clock the Shift Register.

VDD

Positive Supply: +5 volt supply connected to substrate.

VSS

Digital Ground: Connection topside common.

SIG

Signal Current Output: Output for video signal current

SO

End of Scan Pulse: Output from the shift register at end of scan.

Table 1. Pad Symbols and Functions

Bonding pad layout diagram:

Figure 2 shows the bonding pad locations for PI3034A Sensor Chip relative to the lower left corner

of the die.

Figure 2. Bonding Pad Layout Diagram

Electro-Optical Characteristics (25 °C)

Table 2, below, lists the electro-optical characteristics of PI3034A sensor chip at 25 °C.

Parameters

Symbols

Typical

Units

Notes

Number of Photo-elements

64

elements

Pixel-to-pixel spacing

125

µm

Line scanning rate

3.45

ms/line

Clock frequency

0.5

MHz

Video Output Voltage

Amplitude

1.0

Volts

Vp depends the output

circuits. See note 3.

Output voltage non-uniformity

± 7.5

%

7950 µm

SENSOR DIE

290 µm

SI

CLK

VDD

GRD

SIG

SO

Y

X

X

NOTE: ALL PAD OPENINGS ARE 140 X 80 µm.

SI

CLK

VDD

VSS

SIG

SO

START INPUT

CLOCK INPUT

+5 SUPPLY

GROUND

VIDEO SIGNAL OUT

SCAN OUTPUT

67.5

67.5

67.5

67.5

67.5

67.5

737.0

1546.5

2356.0

3156.5

3975.0

7213.0

PAD

FUNCTION

Y

X

PI3034A IMAGE SENSOR

NOTES:

1. THE DRAWING IS NOT TO SCALE.

2. THE DIE LENGTH AND WIDTH

ARE GIVEN AS SHOWN.

3. THE PAD LOCATION ARE GIVEN

IN THE TABLE.

4. THERE ARE TWO EXAMPLES

OF THE X AND Y LOCATIONS

SHOWN ON THE FIRST TWO PADS.

THEY ARE MEASURED TO THE LEFT

BOTTOM CORNER OF THE PAD OPENING.

5. ALL DIMENSIONS ARE IN µm.

Page 2 of 7 - PI3034A, 06/15/03