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MAX2649 Datasheet(PDF) 6 Page - Maxim Integrated Products |
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MAX2649 Datasheet(HTML) 6 Page - Maxim Integrated Products |
6 / 7 page 5GHz Low-Noise Amplifier with Shutdown 6 _______________________________________________________________________________________ Layout information A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, EMI, and stray induc- tance. Use multiple, separate low-inductance-plated vias to the ground plane for each ground bump. The chip-scale package (UCSP) has a bump pitch of 0.5mm (19.7mil) and a bump diameter of 0.3mm (12mil). Therefore, lay out the solder pad spacing on 0.5mm (19.7mil) centers, and use a pad size of 0.25mm (10mil), and a solder mask opening of 0.33mm (13mil). Round or square pads are permissible. Refer to the Maxim application note, Wafer Level Chip-Scale Packaging, for additional detailed information on UCSP layout and handling. UCSP Reliability The chip-scale package (UCSP) represents a unique package that greatly reduces board space compared to other packages. UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and usage environment. Operating life test and moisture resistance remains uncompromised, as it is primarily determined by the wafer-fabrication process. Mechan- ical stress performance is a greater consideration for a UCSP. UCSP solder-joint contact integrity must be con- sidered because the package is attached through direct solder contact to the user’s PC board. Testing done to characterize the UCSP reliability performance shows that it is capable of performing reliably through environ- mental stresses. Results of environmental stress tests and additional usage data and recommendations are detailed in the UCSP application note, which can be found on Maxim’s website, www.maxim-ic.com/ 1st_pages/UCSP.htm. Chip Information TRANSISTOR COUNT: 471 VCC RFIN GND GND RFOUT TOP VIEW SHDN B1 A1 B2 A2 B3 A3 Pin Configuration |
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