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MAX2649 Datasheet(PDF) 6 Page - Maxim Integrated Products

Part # MAX2649
Description  5GHz Low-Noise Amplifier with Shutdown
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX2649 Datasheet(HTML) 6 Page - Maxim Integrated Products

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5GHz Low-Noise Amplifier with Shutdown
6
_______________________________________________________________________________________
Layout information
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, EMI, and stray induc-
tance. Use multiple, separate low-inductance-plated
vias to the ground plane for each ground bump.
The chip-scale package (UCSP) has a bump pitch of
0.5mm (19.7mil) and a bump diameter of 0.3mm
(12mil). Therefore, lay out the solder pad spacing on
0.5mm (19.7mil) centers, and use a pad size of
0.25mm (10mil), and a solder mask opening of 0.33mm
(13mil). Round or square pads are permissible. Refer to
the Maxim application note, Wafer Level Chip-Scale
Packaging, for additional detailed information on UCSP
layout and handling.
UCSP Reliability
The chip-scale package (UCSP) represents a unique
package that greatly reduces board space compared to
other packages. UCSP reliability is integrally linked to
the user’s assembly methods, circuit board material,
and usage environment. Operating life test and moisture
resistance remains uncompromised, as it is primarily
determined by the wafer-fabrication process. Mechan-
ical stress performance is a greater consideration for a
UCSP. UCSP solder-joint contact integrity must be con-
sidered because the package is attached through direct
solder contact to the user’s PC board. Testing done to
characterize the UCSP reliability performance shows
that it is capable of performing reliably through environ-
mental stresses. Results of environmental stress tests
and additional usage data and recommendations are
detailed in the UCSP application note, which can be
found on Maxim’s website, www.maxim-ic.com/
1st_pages/UCSP.htm.
Chip Information
TRANSISTOR COUNT: 471
VCC
RFIN
GND
GND
RFOUT
TOP VIEW
SHDN
B1
A1
B2
A2
B3
A3
Pin Configuration


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