Philips Semiconductors

Product specification

SCN26562

Dual universal serial communications controller (DUSCC)

1995 May 1

2

Character-Oriented Protocol Features

BISYNC Features

after EOT or NAK)

normal text

Bit-Oriented Protocol Features

frames

address

ORDERING INFORMATION

DESCRIPTION

DWG #

DESCRIPTION

Serial Data Rate =

4Mbps Maximum

DWG #

48-Pin Plastic Dual In-Line Package (DIP)

SCN26562C4N48

SOT240-1

52-Pin Plastic Leaded Chip Carrier (PLCC) Package

SCN26562C4A52

SOT238-3

SYMBOL

PARAMETER

RATING

UNIT

0 to +70

°C

Storage temperature

-65 to +150

°C

–0.5 to +7.0

V

V

NOTES:

1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and

functional operation of the device at these or any other conditions above those indicated in the operation section of this specification is not

implied.

2. For operating at elevated temperatures, the device must be derated based on +150

°C maximum junction temperature and thermal

resistance of 36

°C/W junction to ambient for ceramic DIP, 40°C/W for plastic DIP, and 42°C/W for PLCC.

3. This product includes circuitry specifically designed for the protection of its internal devices from damaging effects of excessive static

charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying any voltages larger than the rated maxima.