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4-633
RF3807
Rev A4 050912
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is
3
μinch to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns for PFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern
shown has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to
accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful
process development is recommended.
PCB Metal Land Pattern
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the
PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all
pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask
clearance can be provided in the master data or requested from the PCB fabrication supplier.
A = 1.14 x 0.71
B = 1.02 x 0.71 Typ.
C = 3.96 x 4.44
Dimensions in mm.
C
A
B
B
B
B
B
B
B
Pin 1
5.93
1.27 Typ.
5.99 Typ.
3.00
3.81 Typ.
1.90
A = 1.30 x 0.86
B = 1.17 x 0.86 Typ.
C = 4.11 x 4.60
Dimensions in mm.
5.93
Pin 1
A
C
B
B
B
B
B
B
B
1.27 Typ.
5.99 Typ.
3.00
3.81 Typ.
1.90
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