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GM6603-ATB3R Datasheet(PDF) 7 Page - Gamma Microelectronics Inc. |
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GM6603-ATB3R Datasheet(HTML) 7 Page - Gamma Microelectronics Inc. |
7 / 11 page Output Voltage Sensing GM6603 series is three terminal regulator, so they can- not provide true remote load sensing. Load regulation is limited by the resistance of the conductors connect- ing the regulator to the load. For best results, GM6603 should be connected as shown in Figure 2. Calculating Power Dissipation and Heat Sink Requirements GM6603 series precision linear regulators include ther- mal shutdown and current limit circuitry to protect the devices. However, high power regulators normally oper- ate at high junction temperatures so it is important to calculate the power dissipation and junction tempera- tures accurately to be sure that you use and adequate heat sink. The case is connected to V on GM6603 OUT so electrical isolation may be required for some appli- cations. Thermal compound should always be used with high current regulators like the GM6603. The thermal characteristics of an IC depend on four factors: 1. Maximum Ambient Temperature T (°C) A 2. Power Dissipation P (Watts) D 3. Maximum Junction Temperature T (°C) J 4. Thermal Resistance Junction to ambient R JA Q (°C/W) These relationship of these four factors is expressed by equation (1): Maximum ambient temperature and power dissipa- tion are determined by the design while the maxi- mum junction temperature and thermal resistance depend on the manufacturer and the package type. The maximum power dissipation for a regulator is ex- pressed by equation (2): where: V is the maximum input voltage, IN(max) V is the minimum output voltage, OUT(min) I is the maximum output current OUT(max) I is the maximum quiescent current at I . Q OUT(max) A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC into the air. Each material in the heat flow path between the IC and the environment has a ther- mal resistance. Like series electrical resistances, these resistances are summed to determine R , QJA the total thermal resistance between the junction and the air. This is expressed by equation (3): Where all of the following are in °C/W: R is thermal resistance of junction to case, QJC R is thermal resistance of case to heat sink, QCS R is thermal resistance of heat sink to ambient QSA air The value for R is calculated using equation (3) QJA and the result can be substituted in equation (1). The value for R is 3.5°C/W for a given package QJC type based on an average die size. For a high cur- rent regulator such as GM6603, the majority of the heat is generated in the power transistor section. GM6603-3.3 V IN V OUT R LOAD R C GND V IN Conductor Parasitic Resistance (a) Fixed Version (b) Adjustable Version GM6603-A ADJ V OUT V IN V IN R C R LOAD R1 R2 (a),(b) FIGURE 2 Conductor Parasitic Resistance Effects are Minimized by this Grounding Scheme For Fixed and Adjustable Output Regulators P ={V -V } I + V I D(max) IN(max) OUT(min) IN(max) Q OUT(max) R = R + R + R JA JC CS SA QQQ Q T = T + P X R JAD JA Q 7 Conductor Parasitic Resistance |
Similar Part No. - GM6603-ATB3R |
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Similar Description - GM6603-ATB3R |
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