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A700X107M010ATE010 Datasheet(PDF) 6 Page - Kemet Corporation |
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A700X107M010ATE010 Datasheet(HTML) 6 Page - Kemet Corporation |
6 / 12 page Table 6 - Land Pattern Dimensions for Reflow Solder 31. Soldering The A700 - AO-CAP family has been designed for reflow solder processes, or for wave soldering. The solder-coated terminations have excellent wetting characteristics for high integrity solder fillets. Preheating of these components is recommended to avoid extreme thermal stress. Figure 6 represents the recommended maximum solder temperature/ time combinations for these devices. Hand-soldering should be avoided. However, if nec- essary it should be performed with care due to the difficulty in process control. Care should be taken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solder between the pad and the termi- nation, until reflow occurs. The iron should be removed. "Wiping" the edges of a chip and heating the top surface is not recommended. Figure 6 Sn-Pb Profile measured on the surface of the component * Contact KEMET for the latest A700 Pb-free sol- dering recommendations. 32. Washing Standard washing techniques and solvents are com- patible with all KEMET surface mount aluminum capacitors. Solvents such as Freon TMC and TMS, Trichlorethane, methylene chloride, prelate, and iso- propyl alcohol are not harmful to these components. Please note that we are not endorsing the use of banned or restricted solvents. We are simply stating that they would not be harmful to the components. If ultrasonic agitation is utilized in the cleaning process, care should be taken to minimize energy levels and exposure times to avoid damage to the terminations. KEMET AO-CAPS are also compatible with newer aqueous and semi-aqueous processes. 33. Encapsulations Under normal circumstances, potting or encapsula- tion of KEMET aluminum chips is not required. 34. Storage Environment AO capacitors are shipped in moisture barrier bags with a desiccant and mositure indicator card. This series is classified as MSL3 (Moisture Sensitivity Level 3). Upon opening the moisture barrier bag, parts should be mounted within 7 days to prevent mositure absorption and outgassing. If the 7 day window is exceeded, the parts can be dryed per the instructions on the bag (168 hours at 40 ± 5°C). AO capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term stor- age. In addition, packaging materials will be degrad- ed by high temperature (reels may soften or warp, and tape peel force may increase). KEMET recom- mends that maximum storage temperature not exceed 40 degrees C, and the maximum storage humidity not to exceed 60% relative humidity. In addition, temperature fluctuations should be mini- mized to avoid condensation on the parts, and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability, chip stock should be used promptly, preferably within 1.5 years of receipt. Component Marking Polarity (+) Indicator Picofarad Code KEMET ID 1st Digit = year 2nd & 3rd digits = Week Rated Voltage 476 6K 424 Tape & Reel Packaging Case Codes Tape & Reel Dimensions KEMET EIA Tape Width mm Pitch mm ± 0.1 Reel Quantity Part Spro- cket 180mm (7” dia.) 330mm (13” dia.) V 7343-20 12 ± 0.3 8 4 1000 3000 D 7343-31 12 ± 0.3 8 4 500 2500 X 7343-43 12 ± 0.3 8 4 500 2000 KEMET/EIA Size Code Pad Dimensions Z G X Y (Ref) C (Ref) D/7343-31, V/7343-20 X/7343-43 8.90 3.80 2.70 2.55 6.35 Sn-Pb Profile Series Case Size Typical Weight (mg) A700 V/7343-20 120 A700 D/7343-31 190 A700 X/7343-43 260 Aluminum Component Weights ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 ALUMINUM ORGANIC CAPACITORS Performance Characteristics 0 50 100 150 200 250 300 0 50 100 150 200 250 300 Time (Seconds) 60 Sec. 45 Sec. 45 Sec. 5 Sec. 95 Sec. 90 Sec. Sn-Pb Profile 63 |
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