23. Resistance to Soldering Heat

• Maximum Reflow

+245 ±5°C, 10 seconds

• Typical Reflow

+230 ±5°C, 30 seconds

Post Test Performance:

a. Capacitance: within ±10% of initial value

b. DF: within initial limit

c. DC Leakage: within initial limit

d. ESR: within initial limit

24. Solderability

• Mil-Std-202, Method 208

• ANSI/J-Std-002, Test B

25. Vibration

• Mil-Std-202, Method 204, Condition D, 10 Hz to

2,000 Hz, 20G Peak

Post Test Performance:

a. Capacitance: within ±10% of initial value

b. DF: within initial limit

c. DC Leakage: within initial limit

d. ESR: within initial limit

26. Shock

• Mil-Std-202, Method 213, Condition I, 100 G

Peak

Post Test Performance:

a. Capacitance: within ±10% of initial value

b. DF: within initial limit

c. DC Leakage: within initial limit

d. ESR: within initial limit

27. Terminal Strength

• Pull Force

• One Pound (454 grams), 30 Seconds

• Tensile Force

• Four Pounds (1.8 kilograms), 60 Seconds

•

Shear Force

Table 5 Maximum Shear Loads

Post Test Performance:

a. Capacitance: within ±5% of initial value

b. DF: within initial limit

c. DC Leakage: within initial limit

d. ESR within initial limit

28. Handling

Automatic handling of encapsulated components is

enhanced by the molded case which provides com-

patibility with all types of high speed pick and place

equipment. Manual handling of these devices pres-

ents no unique problems. Care should be taken with

your fingers, however, to avoid touching the solder-

coated terminations as body oils, acids and salts will

degrade the solderability of these terminations.

Finger cots should be used whenever manually han-

dling all solderable surfaces.

29. Termination Coating

The standard finish coating is 100% Sn solder

(Tin-solder coated) with nickel (Ni) underplating.

30. Recommended Mounting Pad Geometries

Proper mounting pad geometries are essential for

successful solder connections. These dimensions

are highly process sensitive and should be designed

to maximize the integrity of the solder joint, and to

minimize component rework due to unacceptable

solder joints.

Figure 5 illustrates pad geometry. The table provides

recommended pad dimensions for reflow soldering

techniques. These dimensions are intended to be a

starting point for circuit board designers, to be fine

tuned, if necessary, based upon the peculiarities of

the soldering process and/or circuit board design.

Contact KEMET for Engineering Bulletin Number

F-2100 entitled "Surface Mount Mounting Pad

Dimensions and Considerations" for further details

on this subject or visit our website at

www.kemet.com.

Case Code

Maximum Shear Loads

KEMET

EIA

Kilograms

Pounds

V

7343-20

5.0

11.0

D

7343-31

5.0

11.0

X

7343-43

5.0

11.0

C

X

Grid

Placement

Courtyard

G

Y

Z

Figure 5

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

ALUMINUM ORGANIC CAPACITORS

Performance Characteristics

62