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A700V476M006ATE025 Datasheet(PDF) 5 Page - Kemet Corporation |
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A700V476M006ATE025 Datasheet(HTML) 5 Page - Kemet Corporation |
5 / 12 page 23. Resistance to Soldering Heat • Maximum Reflow +245 ±5°C, 10 seconds • Typical Reflow +230 ±5°C, 30 seconds Post Test Performance: a. Capacitance: within ±10% of initial value b. DF: within initial limit c. DC Leakage: within initial limit d. ESR: within initial limit 24. Solderability • Mil-Std-202, Method 208 • ANSI/J-Std-002, Test B 25. Vibration • Mil-Std-202, Method 204, Condition D, 10 Hz to 2,000 Hz, 20G Peak Post Test Performance: a. Capacitance: within ±10% of initial value b. DF: within initial limit c. DC Leakage: within initial limit d. ESR: within initial limit 26. Shock • Mil-Std-202, Method 213, Condition I, 100 G Peak Post Test Performance: a. Capacitance: within ±10% of initial value b. DF: within initial limit c. DC Leakage: within initial limit d. ESR: within initial limit 27. Terminal Strength • Pull Force • One Pound (454 grams), 30 Seconds • Tensile Force • Four Pounds (1.8 kilograms), 60 Seconds • Shear Force Table 5 Maximum Shear Loads Post Test Performance: a. Capacitance: within ±5% of initial value b. DF: within initial limit c. DC Leakage: within initial limit d. ESR within initial limit 28. Handling Automatic handling of encapsulated components is enhanced by the molded case which provides com- patibility with all types of high speed pick and place equipment. Manual handling of these devices pres- ents no unique problems. Care should be taken with your fingers, however, to avoid touching the solder- coated terminations as body oils, acids and salts will degrade the solderability of these terminations. Finger cots should be used whenever manually han- dling all solderable surfaces. 29. Termination Coating The standard finish coating is 100% Sn solder (Tin-solder coated) with nickel (Ni) underplating. 30. Recommended Mounting Pad Geometries Proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to maximize the integrity of the solder joint, and to minimize component rework due to unacceptable solder joints. Figure 5 illustrates pad geometry. The table provides recommended pad dimensions for reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers, to be fine tuned, if necessary, based upon the peculiarities of the soldering process and/or circuit board design. Contact KEMET for Engineering Bulletin Number F-2100 entitled "Surface Mount Mounting Pad Dimensions and Considerations" for further details on this subject or visit our website at www.kemet.com. Case Code Maximum Shear Loads KEMET EIA Kilograms Pounds V 7343-20 5.0 11.0 D 7343-31 5.0 11.0 X 7343-43 5.0 11.0 C X Grid Placement Courtyard G Y Z Figure 5 ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 ALUMINUM ORGANIC CAPACITORS Performance Characteristics 62 |
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