Table 6 - Land Pattern Dimensions for Reflow

Solder

31. Soldering

The A700 - AO-CAP family has been designed for

reflow solder processes, or for wave soldering. The

solder-coated terminations have excellent wetting

characteristics for high integrity solder fillets.

Preheating of these components is recommended to

avoid extreme thermal stress. Figure 6 represents

the recommended maximum solder temperature/

time combinations for these devices.

Hand-soldering should be avoided. However, if nec-

essary it should be performed with care due to the

difficulty in process control. Care should be taken to

avoid contact of the soldering iron to the molded

case. The iron should be used to heat the solder

pad, applying solder between the pad and the termi-

nation, until reflow occurs. The iron should be

removed. "Wiping" the edges of a chip and heating

the top surface is not recommended.

Figure 6 Sn-Pb Profile measured on the surface

of the component

* Contact KEMET for the latest A700 Pb-free sol-

dering recommendations.

32. Washing

Standard washing techniques and solvents are com-

patible with all KEMET surface mount aluminum

capacitors. Solvents such as Freon TMC and TMS,

Trichlorethane, methylene chloride, prelate, and iso-

propyl alcohol are not harmful to these components.

Please note that we are not endorsing the use of

banned or restricted solvents. We are simply stating

that they would not be harmful to the components.

If ultrasonic agitation is utilized in the cleaning

process, care should be taken to minimize energy

levels and exposure times to avoid damage to the

terminations.

KEMET AO-CAPS are also compatible with newer

aqueous and semi-aqueous processes.

33. Encapsulations

Under normal circumstances, potting or encapsula-

tion of KEMET aluminum chips is not required.

34. Storage Environment

AO capacitors are shipped in moisture barrier bags

with a desiccant and mositure indicator card. This

series is classified as MSL3 (Moisture Sensitivity

Level 3). Upon opening the moisture barrier bag,

parts should be mounted within 7 days to prevent

mositure absorption and outgassing. If the 7 day

window is exceeded, the parts can be dryed per the

instructions on the bag (168 hours at 40 ± 5°C).

AO capacitors should be stored in normal working

environments. While the chips themselves are quite

robust in other environments, solderability will be

degraded by exposure to high temperatures, high

humidity, corrosive atmospheres, and long term stor-

age. In addition, packaging materials will be degrad-

ed by high temperature (reels may soften or warp,

and tape peel force may increase). KEMET recom-

mends that maximum storage temperature not

exceed 40 degrees C, and the maximum storage

humidity not to exceed 60% relative humidity. In

addition, temperature fluctuations should be mini-

mized to avoid condensation on the parts, and

atmospheres should be free of chlorine and sulfur

bearing compounds. For optimized solderability, chip

stock should be used promptly, preferably within 1.5

years of receipt.

Component Marking

Polarity (+)

Indicator

Picofarad

Code

KEMET ID

1st Digit = year

2nd & 3rd digits =

Week

Rated

Voltage

476

6K

424

Tape & Reel Packaging

Case Codes

Tape & Reel Dimensions

KEMET

EIA

Tape

Width

mm

Pitch

mm ± 0.1

Reel Quantity

Part

Spro-

cket

180mm

(7” dia.)

330mm

(13” dia.)

V

7343-20 12 ± 0.3

8

4

1000

3000

D

7343-31 12 ± 0.3

8

4

500

2500

X

7343-43 12 ± 0.3

8

4

500

2000

KEMET/EIA Size

Code

Pad Dimensions

Z

G

X

Y (Ref)

C (Ref)

D/7343-31, V/7343-20

X/7343-43

8.90

3.80

2.70

2.55

6.35

Sn-Pb Profile

Series

Case Size

Typical Weight

(mg)

A700

V/7343-20

120

A700

D/7343-31

190

A700

X/7343-43

260

Aluminum Component Weights

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

ALUMINUM ORGANIC CAPACITORS

Performance Characteristics

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (Seconds)

60 Sec.

45 Sec.

45 Sec.

5 Sec.

95 Sec.

90 Sec.

Sn-Pb Profile

63