Sensors

4

Freescale Semiconductor

MPX4200A

ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION

Figure 2. Cross Sectional Diagram (not to scale)

Figure 3. Recommended Power Supply

Decoupling and Output Filtering

(For additional output filtering, please refer to

Application Note AN1646)

Figure 4. Output versus Absolute Pressure

Figure 2 illustrates the absolute sensing chip in the basic

chip carrier (Case 867). A fluorosilicone gel isolates the die

surface and wire bonds from the environment, while allowing

the pressure signal to be transmitted to the sensor

diaphragm. The MPX4200A series pressure sensor

operating characteristics, and internal reliability and

qualification tests are based on use of dry air as the pressure

media. Media, other than dry air, may have adverse effects on

sensor performance and long-term reliability. Contact the

factory for information regarding media compatibility in your

application.

Figure 3 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

pressure input. Typical minimum and maximum output

curves are shown for operation over temperature range of

0° to 85°C. The output will saturate outside of the specified

pressure range.

Stainless Steel

Metal Cover

Epoxy Case

RTV Die Bond

P2

Sealed Vacuum Reference

Lead Frame

Wire Bond

Die

P1

Silicone

Die Coat

+5 V

1.0 µF

0.01 µF

470 pF

GND

IPS

Output

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0

TYP

MIN

MAX

Transfer Function:

Temperature = 0 to 85°C