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MPXH6101A6T1 Datasheet(PDF) 6 Page - Freescale Semiconductor, Inc |
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MPXH6101A6T1 Datasheet(HTML) 6 Page - Freescale Semiconductor, Inc |
6 / 12 page MPX4101A Sensors 6 Freescale Semiconductor INFORMATION FOR USING THE SMALL OUTLINE PACKAGES MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. Figure 5. SOP Footprint (Case 482) Figure 6. SSOP Footprint (Case 1317) 0.660 16.76 0.060 TYP 8X 1.52 0.100 TYP 8X 2.54 0.100 TYP 8X 2.54 0.300 7.62 inch mm SCALE 2:1 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm 0.387 9.83 0.150 3.81 0.050 1.27 TYP |
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