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MPC8270VRP Datasheet(PDF) 11 Page - Freescale Semiconductor, Inc |
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MPC8270VRP Datasheet(HTML) 11 Page - Freescale Semiconductor, Inc |
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11 / 80 page  MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 11 Thermal Characteristics 4 Thermal Characteristics Table 6 describes thermal characteristics for both the packages. See Table 2 for information about a given device’s package. For the discussions sections 4.1 and 4.5, PD = (VDD × IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers. 4.1 Estimation with Junction-to-Ambient Thermal Resistance An estimation of the chip junction temperature, TJ, in C can be obtained from the following equation: TJ = TA + (RθJA × PD) where: TA = ambient temperature (ºC) RθJA = package junction-to-ambient thermal resistance (ºC/W) PD = power dissipation in package The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible. 3 The leakage current is measured for nominal VDDH,VCCSYN, and VDD. 4 VIL for IIC interface does not match IIC standard, but does meet IIC standard for VOL and should not cause any compatibility issue. 5 MPC8280, MPC8275VR, MPC8275ZQ only. Table 6. Thermal Characteristics Characteristic Symbol Value Unit Air Flow 480 TBGA 516 PBGA Junction to ambient— single-layer board 1 1 Assumes no thermal vias. RθJA 16 27 °C/W Natural convection 11 21 1 m/s Junction to ambient— four-layer board RθJA 12 19 °C/W Natural convection 916 1 m/s Junction to board 2 2 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. RθJB 611 °C/W — Junction to case 3 3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). RθJC 28 °C/W — Junction-to-package top 4 4 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. Ψ JT 22 °C/W — |
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