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OXCB950 Datasheet(PDF) 8 Page - Oxford Semiconductor

Part # OXCB950
Description  Integrated High Performance UART Cardbus / 3.3v PCI interface
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Manufacturer  OXFORD [Oxford Semiconductor]
Direct Link  http://www.oxsemi.com
Logo OXFORD - Oxford Semiconductor

OXCB950 Datasheet(HTML) 8 Page - Oxford Semiconductor

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DS-0033 Sep 05
External-Free Release
Page 8
OXCB950
OXFORD SEMICONDUCTOR LTD.
4 PIN DESCRIPTIONS
Cardbus/PCI bus Pins
Dir2
Name
Description
1, 3, 4, 5, 8, 9, 10, 11, 16, 17, 18,
19, 22, 23, 24, 25, 52, 53, 54, 57,
58, 60, 61, 66, 69, 73, 74, 75, 77,
78, 79, 100
C/P_I/O
AD[31:0]
Multiplexed Address/Data bus.
67, 80, 99, 15
C/P_I
C/BE[3:0]#
Multiplexed Command/Byte enable.
88
CP_I
CLK
System clock
83
CP_I
FRAME#
Cycle Frame1.
93
CP_O
DEVSEL#
Device Select
84
CP_I
IRDY#
Initiator ready
85
CP_O
TRDY#
Target ready
95
CP_O
STOP#
Target Stop request
98
CP_I/O
PAR
Parity
72
CP_O
SERR#
System error
96
CP_I/O
PERR#
Parity error
68
CP_I
IDSEL
Initialisation device select
For PCI applications this pin must be connected to the IDSEL
pin on the PCI connector. For cardbus applications, there is
no IDSEL signal, so this pin must be tied to Vdd (3.3v) via a
pull-up on the board. (10K recommended).
86
CP_I
RST#
System reset
94
CP_OD
INTA# /CINT#
Interrupt Pin. For both cardbus and pci applications
59
CP_O
CSYSCHG
Power management event signal, for Cardbus applications
This pin must be No-Connect (NC) for PCI applications.
51
CP_OD
PME#
Power management event signal, for PCI applications
This pin must be No-Connect (NC) for cardbus applications.
32
I
SLEW_RATE
Slew rate control for cardbus/pci outputs
For cardbus applications, this must be tied to Vdd on the
board. For PCI applications, this must be tied to Gnd on the
board.


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