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AP601-PCB1960 Datasheet(PDF) 10 Page - WJ Communication. Inc. |
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AP601-PCB1960 Datasheet(HTML) 10 Page - WJ Communication. Inc. |
10 / 10 page Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com Page 10 of 10 May 2007 ver 1 AP601 High Dynamic Range 1.8W 28V HBT Amplifier AP601-F Mechanical Information This package is lead-free and RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper. Drawing Outline Drawing Mounting Configuration / Land Pattern Thermal Specifications Parameter Rating Thermal Resistance, ΘJC Referenced from peak junction to the center of the bottomside ground paddle 33.3 °C / W Junction Temperature, TJ For 106 hours MTTF 192 ºC Max Junction Temperature, TJ,max For catastrophic failure 250 ºC Product Marking The component will be laser marked with a “AP601-F” product label with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part will be located on the website in the “Application Notes” section. Functional Pin Layout Pin Function 1 PIN_VBIAS 2, 3, 7, 8, 12, 13 N/C 4, 5, 6 RF IN 9, 10, 11 RF Output / Vcc 14 PIN_VPD Backside paddle GND MSL / ESD Rating ESD Rating: Class 1B Value: Passes 500V to <1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Rating: Class IV Value: Passes 1000V to <2000V Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 MTTF vs. Junction Temperature 1.E+05 1.E+06 1.E+07 1.E+08 1.E+09 120 140 160 180 200 Junction Temperature (°C) |
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