Specifications and information are subject to change without notice

WJ Communications, Inc

• Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com

Page 5 of 5

April 2006

AG203-63

InGaP HBT Gain Block

Product Information

The Communications Edge

TM

AG203-63G (Green / Lead-free SOT-363 Package) Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260

°C reflow temperature) and leaded

(maximum 245

°C reflow temperature) soldering processes. The plating material on the leads is annealed matte tin over copper.

Outline Drawing

Land Pattern

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85

°C

Thermal Resistance, Rth

(1)

472

°C / W

Junction Temperature, Tj

(2)

123

°C

1. The thermal resistance is referenced from the hottest

part of the junction to the ground pin (pin 4).

2. This corresponds to the typical biasing condition of

+4.05V, 20 mA at an 85

°C case temperature. A

minimum MTTF of 1 million hours is achieved for

junction temperatures below 177

°C.

Product Marking

The component will be marked with an “H”

designator followed by a two-digit numeric lot

code on the top surface of the package. The

obsolete tin-lead package is marked with a “C”

designator followed by a two-digit numeric lot

code on the top surface of the package.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

MSL / ESD Rating

ESD Rating: Class 1C

Value:

Passes

≥ 1000V min.

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value:

Passes

≥ 1000V min.

Test:

Charged Device Model (CDM)

Standard:

JEDEC Standard JESD22-C101

MSL Rating: Level 3 at +260

°C convection reflow

Standard:

JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper

performance of this device.

Vias should use a .35mm

(#80 / .0135”) diameter drill and have a final plated thru

diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers

near the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the

board to a heatsink. Ensure that the ground / thermal via

region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board in

the region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in

degrees.

MTTFvs.GNDLeadTemperature

1

10

100

1000

10000

60

70

80

90

100

110

120

GroundLeadTemperature(°C)