M/A-COM Inc. and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice. M/A-COM makes

no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

3

V2

MADP-042005 Series

µm PIN Diodes—MADP-042305-130600,

MADP-042405-130600, MADP-042505-130600, MADP-042905-130600

Handling Procedures

All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and

skin oils.

The use of plastic tipped tweezers or vacuum pickups is strongly recommended for

individual components. Bulk handling should insure that abrasion and mechanical shock are minimized.

Bonding Techniques

Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are

conveniently located on the bottom surface of these devices and are removed from the active

junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of

80 Au / 20 Sn @ ~ + 280 °C or Sn 60 / Pb 40 ~ + 185 °C solder is recommended. Conductive silver epoxy for

die attachment ~ + 150 °C may also be used for lower Incident power ( < 1 W Average Power ) applications.

When soldering these devices to a hard substrate, hot gas die bonding is preferred. We re-commend utilizing a

vacuum tip and force of 60 to100 grams applied normal to the top surface of the device. When soldering to soft

substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so

that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the

circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top

surface of the die. The solder joint must Not be made one at a time, creating un-equal heat flow and thermal

stress. Solder reflow should Not be performed by causing heat to flow through the top surface of the die. Since

the HMIC glass is transparent, the edges of the mounting pads closest to each other can be visually inspected

through the die after attach is completed.

A typical profile for a Sn 60/ Pb 40 Soldering process is provided in Application Note, “ M538 ” , “ Surface

Mounting Instructions “ on the MA-COM website www.macom.com