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MAAPGM0076-DIE Datasheet(PDF) 6 Page - Tyco Electronics |
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MAAPGM0076-DIE Datasheet(HTML) 6 Page - Tyco Electronics |
6 / 7 page Amplifier, Power, 16W 1.3-2.5 GHz MAAPGM0076-DIE M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Rev B Preliminary Datasheet 6 Pad Size ( μm) RF In and Out 200 x 250 DC Drain Supply Voltage VD1 200 x 150 DC Gate Supply Voltage VG2 100 x 100 Size (mils) 8 x 10 4 x 8 4 x 4 DC Gate Supply Voltage VG1 150 x 125 6 x 5 DC Drain Supply Voltage VD2 500 x 200 20 x 8 Bond Pad Dimensions Chip edge to bond pad dimensions are shown to the center of the bond pad. Mechanical Information Chip Size: 5.000 x 8.150 x 0.075 mm ( 197 x 321 x 3 mils) Figure 17. Die Layout |
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