Amplifier, Power, 0.6W

1.5-3.3 GHz

MAAPGM0026-DIE

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no warranty, representation or guarantee regarding the suitability of its

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903185 —

Preliminary Information

4

Mechanical Information

Chip Size: 2.980 x 1.580 x 0.075 mm

(

117 x 62 x 3 mils)

Pad

Size (

μm)

RF In and Out

100 x 200

DC Drain Supply Voltage VDD

200 x 150

DC Gate Supply Voltage VGG

150 x 150

Size (mils)

4 x 8

8 x 6

6 x 6

Bond Pad Dimensions

Figure 5. Die Layout

0.202mm.

0

0

0.840mm.

1.378mm.

1.580mm.

0.840mm.

Chip edge to bond pad dimensions are shown to the center of the bond pad.