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MAAPGM0026-DIE Datasheet(PDF) 4 Page - Tyco Electronics |
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MAAPGM0026-DIE Datasheet(HTML) 4 Page - Tyco Electronics |
4 / 5 page Amplifier, Power, 0.6W 1.5-3.3 GHz MAAPGM0026-DIE M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. 903185 — Preliminary Information 4 Mechanical Information Chip Size: 2.980 x 1.580 x 0.075 mm ( 117 x 62 x 3 mils) Pad Size ( μm) RF In and Out 100 x 200 DC Drain Supply Voltage VDD 200 x 150 DC Gate Supply Voltage VGG 150 x 150 Size (mils) 4 x 8 8 x 6 6 x 6 Bond Pad Dimensions Figure 5. Die Layout 0.202mm. 0 0 0.840mm. 1.378mm. 1.580mm. 0.840mm. Chip edge to bond pad dimensions are shown to the center of the bond pad. |
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