Amplifier, Power, 16W

1.3-2.5 GHz

M/A-COM Inc. and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice. M/A-COM makes

no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

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Visit www.macom.comfor additional data sheets and product information.

Rev —

Preliminary Datasheet

6

MAAP-000076-PED000

Pad

Size (

μm)

RF In and Out

200 x 250

DC Drain Supply Voltage VD1

200 x 150

DC Gate Supply Voltage VG2

100 x 100

Size (mils)

8 x 10

4 x 8

4 x 4

DC Gate Supply Voltage VG1

150 x 125

6 x 5

DC Drain Supply Voltage VD2

500 x 200

20 x 8

Pad No.

1

2

3

4

5

Bond Pad Dimensions

Chip edge to bond pad dimensions are shown to the center of the bond pad.

Mechanical Information

Chip Size: 5.203 x 8.352 x 0.356 mm

(

205 x 329 x 14 mils)

Figure 17. Die Layout