Amplifier, Power, 10W

8.5—10.5 GHz

MA08509D

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no warranty, representation or guarantee regarding the suitability of its

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whatsoever arising out of the use or application of any product(s) or

information.

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Rev A

Preliminary Information

5

Figure 5. Recommended bonding diagram for pedestal mount.

Support circuitry typical of MMIC characterization fixture for CW testing.

NOTE: Indicated Gate voltage pad (VGG 2) represents the nominal bias

condition. However, the device current can be increased or decreased

as required by bonding to either VGG 1 or VGG 3 (respectively).

Assembly Instructions:

Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 310 °C to less

than 7 minutes. Refer to Application Note AN3017 for more detailed information.

Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge

bond techniques. For DC pad connections, use either ball or wedge bonds. For best

RF performance, use wedge bonds of shortest length, although ball bonds are also

acceptable.

100 pF

100 pF

RF

IN

RF

OUT

0.1

μF

V

GG

100 pF

100 pF

100 pF

100 pF

0.1

μF

V

GG

0.1

μF

V

DD

0.1

μF

0.1

μF

V

DD

0.1

μF

Assembly and Bonding Diagram