SurMount

MA4E2514 Series

V 2.00

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or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

2

Electrical Specifications: @ 25 °C (Measured as Single Diodes)

Rt is the dynamic slope resistance where

Rt = Rs + Rj, where Rj = 26 / Idc (Idc is in mA) and Rs is the

Ohmic Resistance

Handling

All semiconductor chips should be handled with care to avoid

damage or contamination from perspiration and skin oils. The

use of plastic tipped tweezers or vacuum pickups is strongly

recommended for individual components. The top surface of

the die has a protective polyimide coating to minimize damage.

The rugged construction of these SurMount devices allows the

use of standard handling and die attach techniques. It is

important to note that industry standard electrostatic discharge

(ESD) control is required at all times, due to the sensitive

nature of Schottky junctions.

Bulk handling should insure that abrasion and mechanical

shock are minimized.

Parameter

Value

Operating Temperature

-40 °C to +150 °C

Storage Temperature

-40 °C to +150 °C

Forward Current

20 mA

Reverse Voltage

5 V

RF C.W. Incident Power

+ 20 dBm

RF & DC Dissipated Power

50 mW

Absolute Maximum Ratings

1

1. Exceeding any of these values may result in permanent

damage

Model

Number

Type

Recommended

Frequency

Range

Vf @ 1

mA

( mV )

Vf @ 10 uA

( V )

Ct @ 0 V

( pF )

Rt Slope Resistance

( Vf1 - Vf2 )/(10.5 mA-9.5 mA )

(

Ω )

MA4E2514L

Low

Barrier

DC - 18 GHz

330 Max

300 Typ

3 Min

5 Typ

0.12 Max

0.10 Typ

16 Typ

20 Max

MA4E2514M

Medium

Barrier

DC - 18 GHz

470 Max

400 Typ

3 Min

5 Typ

0.12 Max

0.10 Typ

12 Typ

18 Max

Max Forward Voltage Difference

∆Vf @ 1 mA: 10 mV

Max Total Capacitance Difference

∆Ct @ 0 V: 0.03 pF

Die Bonding

Die attach for these devices is made simple through the use

of surface mount die attach technology. Mounting pads are

conveniently located on the bottom surface of these

devices, and are opposite the active junction. The devices

are well suited for higher temperature solder attachment

onto hard substrates. 80Au/20Sn and Sn63/Pb37/Ag solders

are acceptable for usage.

For Hard substrates, we recommend utilizing a vacuum tip

and force of 60 to 100 grams applied uniformly to the top

surface of the device, using a hot gas bonder with equal

heat applied across the bottom mounting pads of the device.

When soldering to soft substrates, it is recommended to use

a lead-tin interface at the circuit board mounting pads.

Position the die so that its mounting pads are aligned with

the circuit board mounting pads. Reflow the solder paste by

applying Equal heat to the circuit at both die-mounting

pads. The solder joint must Not be made one at a time,

creating un-equal heat flow and thermal stress. Solder

reflow should Not be performed by causing heat to flow

through the top surface of the die. Since the HMIC glass is

transparent, the edges of the mounting pads can be visually

inspected through the die after die attach is completed.