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PHP3N20L Datasheet(PDF) 1 Page - NXP Semiconductors |
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PHP3N20L Datasheet(HTML) 1 Page - NXP Semiconductors |
1 / 7 page Philips Semiconductors Product specification PowerMOS transistor PHP3N20L Logic level FET GENERAL DESCRIPTION QUICK REFERENCE DATA N-channel enhancement mode logic SYMBOL PARAMETER MAX. UNIT level field-effect power transistor in a plastic envelope featuring high V DS Drain-source voltage 200 V avalanche energy capability, stable I D Drain current (DC) 3.5 A blocking voltage, fast switching and P tot Total power dissipation 50 W high thermal cycling performance R DS(ON) Drain-source on-state resistance 1.5 Ω with low thermal resistance. Intended for use in Switched Mode Power Supplies (SMPS), motor control circuits and general purpose switching applications. PINNING - TO220AB PIN CONFIGURATION SYMBOL PIN DESCRIPTION 1 gate 2 drain 3 source tab drain LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT I D Continuous drain current T mb = 25 ˚C; VGS = 10 V - 3.5 A T mb = 100 ˚C; VGS = 10 V - 2.5 A I DM Pulsed drain current T mb = 25 ˚C - 14 A P D Total dissipation T mb = 25 ˚C - 50 W ∆P D/∆Tmb Linear derating factor T mb > 25 ˚C - 0.33 W/K V GS Gate-source voltage - ± 15 V V GSM Non-repetitive gate-source t p ≤ 50 µs- ± 20 V voltage E AS Single pulse avalanche V DD ≤ 50 V; starting Tj = 25˚C; RGS = 50 Ω; - 25 mJ energy V GS = 5 V I AS Peak avalanche current V DD ≤ 50 V; starting Tj = 25˚C; RGS = 50 Ω; - 3.5 A V GS = 5 V T j, Tstg Operating junction and - 55 175 ˚C storage temperature range THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT R th j-mb Thermal resistance junction to - 3 K/W mounting base R th j-a Thermal resistance junction to 60 - K/W ambient 12 3 tab d g s September 1997 1 Rev 1.000 |
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